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Ceramic column grid array packaging and column planting device

A ceramic pillar grid array and pillar planting technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as welding pillar damage, and achieve the effects of good product consistency, improved work efficiency, and easy operation

Active Publication Date: 2011-04-20
BEIJING MXTRONICS CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical solution of the present invention is to overcome the deficiencies of the prior art and provide a ceramic pillar grid array packaging pillar planting device. At the same time, it also avoids the problem of damage to the welding column due to the surface clamping force formed by the manual planting column using clips to clamp the welding column

Method used

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  • Ceramic column grid array packaging and column planting device
  • Ceramic column grid array packaging and column planting device
  • Ceramic column grid array packaging and column planting device

Examples

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Embodiment Construction

[0021] The present invention will be further introduced below in combination with specific embodiments.

[0022] Such as figure 1 , is a cross-sectional view along the axis of the ceramic column grid array packaged column planting device according to the present invention, including: a feeding tube 1, a silo 3, a casing 4, a valve 5 and a cap 6, and also includes a pressure plate 2 and a ferrule 7.

[0023] Among them, the feeding pipe 1 is a flexible pipe with two ends open, which is used to fill the solder to the column planting device; The axial direction is arranged up and down in sequence; the valve 5 is a switch device used to control the output of the welding column, and within a suitable time interval, each time the valve is opened, a welding column can be sent out; the jacket 4 and the cap 6 are used to cover the material bin 3 and The valve 5; the cap 6 has a discharge opening 61 opposite to the opening of the valve. In this embodiment, the pressing plate 2 is ins...

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Abstract

The invention relates to a ceramic column grid array packaging and column planting device. The invention is characterized in that the device comprises a feeding tube, a stock bin, a sheath, a valve and a cap, wherein the feeding tube, the stock bin and the valve are sequentially connected, the tube cavities are opposite along axial direction, the stock bin and the valve are respectively sheathed in the sheath and the cap, the cap is provided with a discharge hole, and the discharge hole is opposite to the tube cavity of the valve. A welding column is arranged in the tube cavity of the column planting device by virtue of the feeding tube, the column planting device is vertically placed on the case of the tube to be welded when planting the column, and the stock bin drives the valve to movealong axial direction in the sheath, thus controlling the delivery of the welding column by utilizing the open and close of the tube cavity of the valve to realize automatic welding column planting. By utilizing the invention, the problems that manual column planting wastes time and labor and the accuracy is low are solved, and the work efficiency and the column planting accuracy are greatly improved.

Description

technical field [0001] The invention relates to a pillar planting device, in particular to a pillar planting device when packaged by a ceramic column grid array process, and belongs to the technical field of integrated circuit packaging. Background technique [0002] The Ceramic Column Grid Array (CCGA, Ceramic Column Grid Array) package is an extension of the Ceramic Ball Grid Array (CBGA, Ceramic Ball Grid Array) package. When the size of the CBGA package is larger than 32 mm, the reliability of the CBGA solder balls is reduced, which cannot meet the requirements of high-reliability applications. The CCGA package uses columnar pins instead of CBGA spherical pins, which greatly improves its reliability and heat dissipation performance. At the same time, due to the use of ceramic packages and columnar pins, CCGA parts have good moisture resistance, forming CCGA. Long service life and high reliability are increasing in military, aerospace and telecommunications applications....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/60
Inventor 于海平曹玉生林鹏荣
Owner BEIJING MXTRONICS CORP
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