171results about How to "Eliminate height difference" patented technology

The invention discloses a plastic package device opening method. The plastic package device opening method comprises positioning the positions and the depths of various elements inside a plastic package device to obtain the size, position and depth information of the various elements and the chip inside the device; opening the plastic package device through a laser ablation method to remove package materials on the surface of the plastic package device to exactly expose internal lead bonding wires in a chip area, tin-lead solder spots adjacent to a resistance capacitor, and an inductor adjacent to the inductor; masking the ablated plastic package device to mask the area not requiring corrosion with aluminum foils, and performing local corrosion on the masked plastic package device through corrosives. The plastic package device opening method can help precisely control the opening depth of every local area of the plastic package device and the properties of the corrosives, achieve precise multi-spot and layer-by-layer opening control effects and well solve the problem that traditional methods cannot easily open plastic package mixed integrated circuits.

In an apparatus for the fibre-sorting or fibre-selection of a fibre bundle comprising textile fibres, especially for combing, which is supplied by a supply device to a fibre-sorting device, especially a combing device, having clamping devices, which clamp the fibre bundle at a distance from its free end, for combing to remove non-clamped constituents, at least one take-off device 14 with a sliver-forming element is present, downstream of which is a drafting system. To increase productivity and improve the combed sliver, the fibre-sorting device has at least two rotatably mounted rollers rotating rapidly without interruption, having the clamping devices and between the sliver-forming element and the drafting system the at least one fibre sliver is present in the form of a fibre structure having a width greater than its height, for example, following spreading by a web-spreader.

The invention discloses a slope-variable proportional alternate jacking construction method for continuous beam bridges. The slope-variable proportional alternate jacking construction method includes setting two groups of jacks capable of actively applying jacking force at the bottom of a bridge structure corresponding to fronts and backs of a pier and an abutment; enabling a control panel to control a hydraulic pump station to drive the two groups of jacks to carry out slope-variable proportional alternate jacking; and plugging temporary steel support cushion blocks at bottoms of one group of jacks when the other group of jacks performs jacking so as to eliminate height differences among various support points. The slope-variable proportional alternate jacking construction method has the advantages that the safety of the bridge structure is effectively guaranteed in a jacking procedure; and the requirement on a design gesture of an existing beam is met by the continuous slope-variable proportional alternate jacking method, and accordingly the purpose of modifying an existing bridge is achieved.

The invention discloses a glass processing platform and a method for processing glass. The glass processing platform comprises a platform deck used for directly supporting the glass, a first vacuum absorption device and a lifting device, wherein the platform deck is provided with a plurality of first through holes; the first vacuum absorption device comprises a base, a plurality of support rods, vacuum chucks and a first vacuum pipeline, wherein one ends of the support rods are fixed on the base, and the other ends of the support rods are provided with the vacuum chucks, and the first vacuum pipeline is connected with the vacuum chucks; the lifting device is used for forming the height difference between the absorption surfaces of the vacuum chucks and the bearing surface of the platform deck, and eliminating the height difference to enable the absorbed surface of the glass and the bearing surface of the platform deck to be in the same horizontal plane after the glass is absorbed by the vacuum chucks; the support rods are arranged in the first through holes and penetrate through the platform deck; the vacuum chucks can downwards move or be elastically deformed downwards when the vacuum chucks are subjected to the pressing pressure of the glass. Therefore, the warped glass can be flattened and adhered onto the bearing surface of the platform deck, so that the success ratio of the platform deck absorbing the glass can be improved.

The invention provides a high-precision flat plate-type brake test bench, which is composed of a supporting frame, a brake soleplate, a bearing frame, brake force detection mechanisms, a wheel weight detection mechanism and a guide limiting mechanism, wherein two sides of the supporting frame are symmetrically provided with two grooves, the notch of each groove faces inwardly, and thus, the supporting frame presents a symmetrical structure in a shape like a Chinese character zhong; the bearing frame is arranged at the inner side of the supporting frame; the brake soleplate is fixedly arranged above the bearing frame; two groups of brake force detection mechanisms are symmetrically arranged in the grooves at two sides of the supporting frame; the wheel weight detection mechanism is located between the bearing frame and the bottom plate of the supporting frame; and the guide limiting mechanism is connected with the bearing frame and the supporting frame. The technical scheme of the invention can effectively improve defects existing in aspects such as the overall frame structure of the traditional flat plate-type brake test bench and the wheel brake equivalent transfer and brake force acquisition, and the brake force detection precision of the flat plate-type brake test bench is improved.

A vehicle installed battery pack is provided with a pressure release structure. The vehicle installed battery pack includes a battery pack case, a battery pack module. The battery pack case includes a battery pack lower frame and a battery pack upper cover. The battery pack module is disposed in the battery pack lower frame. The battery pack upper cover is securely joined to the battery pack lower frame via a seal member that extends continuously about an entire perimeter of respective outside peripheral edge portion of the battery pack upper cover. The battery pack upper cover includes a deforming stepped portion having a height difference at least in a heightwise direction; and a weakly joined portion having a lower joint strength than other joined portions being set in an area of the seal member extending continuously about the entire perimeter. The area corresponds to the deforming stepped portion.

A liquid crystal module package box includes a box body, two retention racks that are arranged in the box body and opposite to each other, and a plurality of sets of air-cushioning bags, whereby to package, liquid crystal modules are positioned between the two retention racks and the plurality of sets of air-cushioning bags is alternately fit over the liquid crystal modules. The liquid crystal module package box of the present invention uses retention racks and air-cushioning bags arranged inside the box body to effectively protect the liquid crystal modules so as to avoid damages of the liquid crystal modules caused by external forces. Further, the package structure is simple, where air-cushioning bags are alternately fit over the liquid crystal modules to provide a high utilization rate and lower down material cost. Further, the retention racks are provided with cushioning units to effectively cushion the liquid crystal modules.

The invention relates to a device for treating piece goods (18) of a transport unit (16), particularly a swappable container and unloading device. The device has a movable conveyor unit (22), driven into the transport unit so as to unloading the transport unit (16). Under control of an operator (46), piece-goods (18) stacked in the transport unit are received and shipped out from the transport unit (16) in a discharge direction (24) for further processing. In order to provide a device capable of shipping out inconsistently or unclassified stacked piece-goods with low operational cost, the invention provides a conveyor unit (22) comprising a bottom conveyor (28) that conveys the piece goods fallen from a piece-goods stack (38) in a loose arrangement.

The present application disclose a wheel blank positioning end face correction device, comprising a frame, a servo motor I, a support frame, a bearing seat, a bearing, a shaft, a rotating platform, a guide rail, a cylinder, a left slide plate, a left bearing seat, a left shaft, a left bearing, a left driven grooved friction wheel, a left workbench, corner cylinder pressure claws, mandrel seats, mandrels, a grinding wheel, a grinding wheel drive motor, a support plate, a feeding slide plate, feeding guide rails, a linear motor, a distance measuring sensor, a fixed plate, a servo motor II, a driving grooved friction wheel, a right workbench, a right driven grooved friction wheel, a right shaft, a gear rack structure and a right slide plate.

The invention provides flat tempered vacuum glass. The glass comprises upper glass and lower glass, wherein the upper and lower glass are flat tempered glass; edge sealing strip frames are arranged on the peripheries of the welding surfaces of the upper and lower glass; the peripheries of the upper and lower glass are welded together through low-temperature solders which are low-melting-point metal or alloy solders; and a closed vacuum layer is formed between the upper glass and the lower glass and is internally provided with supports which are arranged in a lattice manner. A manufacturing method of the vacuum glass provided by the invention is simple in process; and the manufactured tempered vacuum glass can overcome the defects in the prior art and can be subjected to mass production.

The invention provides an LED chip based on a graphical reflector and a manufacturing method of the LED chip. A dielectric film layer grows on the surface of a second type window layer, the dielectricfilm layer comprises a dielectric film and an adhesion layer which are sequentially stacked in the first direction, and the dielectric film layer is provided with a plurality of dielectric holes usedfor forming ohmic contact; the metal reflector is in ohmic contact with the second type window layer through the ohmic contact material in the dielectric hole; good ohmic contact between the metal reflector and the second type window layer is ensured; the adhesion layer is additionally arranged between the dielectric film and the metal reflector, so that the adhesion between the metal material ofthe metal reflector and the dielectric film is improved, the surface of one side, close to the epitaxial laminated layer, of the metal reflector is smoother, the reflection effect of the metal reflector is enhanced, and the high light extraction rate of light is realized. Meanwhile, patterning of the metal reflector can be achieved, so that the reflection path of light is changed, and the light emitting efficiency of the LED chip is improved.

A plurality of IC regions are formed on a semiconductor wafer, which is cut into individual chips incorporating ICs, wherein wiring layers and insulating layers are sequentially formed on a silicon substrate. In order to reduce height differences between ICs and scribing lines, a planar insulating layer is formed to cover the overall surface with respect to ICs, seal rings, and scribing lines. In order to avoid occurrence of breaks and failures in ICs, openings are formed to partially etch insulating layers in a step-like manner so that walls thereof are each slanted by prescribed angles ranging from 20° to 80°. For example, a first opening is formed with respect to a thin-film element section, and a second opening is formed with respect to an external-terminal connection pad.

The embodiment of the invention provides a portable electronic product capable of eliminating combination bubbles, a touch screen for the same and a touch screen preparation method, and aims to solve the problem of combination bubbles between an ink layer and a panel in the prior art. The touch screen for the portable electronic product sequentially comprises a panel, an ink layer, a self-adhesive tape layer and a sensing layer from top to bottom, wherein the ink layer is arranged on the peripheral edge of the lower surface of the panel; the middle area of the lower surface of the panel is a visible area which is not coated with ink; the surfaces of the ink layer and the visible area are coated with an anti-bubble adhesive layer; the sensing layer is adhered to the anti-bubble adhesive layer through the self-adhesive tape layer. According to the touch screen for the portable electronic product, a height difference between the ink layer and the glass panel can be effectively eliminated to prevent the formation of the combination bubbles by virtue of the anti-bubble adhesive layer. Therefore, the touch screen is more favorably thinned, the thickness of the ink layer of the touch screen can be ensured, color effects of the panel of the touch screen can be ensured, and higher overall color uniformity can be achieved.

The invention discloses a preparation method of a semiconductor device. According to the invention, in the process of forming a polysilicon gate through etching a polysilicon layer, an etching area is ensured to be kept away from a zero layer alignment identifier, the polysilicon layer formed by etching is still enabled to cover the zero layer alignment identifier, the height difference in chip caused by the zero layer alignment identifier is introduced into the polysilicon gate, and then the height difference is eliminated in the follow-up interlayer dielectric filling and flattening process, thereby simplifying the steps of silicon oxide filling, flattening, wet etching and the like of the zero layer alignment identifier in a traditional zero layer alignment technology through optimizing the design of the polysilicon layer and the depth of the zero layer alignment identifier, realizing a semiconductor preparation technology without shallow trench isolation, and being simple in technological process and low in cost.

A tiling display device includes a plurality of display panel modules, each including: a display panel including a display area and a non-display area; a form support member bonded to the bottom surface of the display panel and supporting the form of the display panel; a fixing member attached to the bottom surface of the form support member; and a case top placed around the fixing member, for attaching to the fixing member, wherein at least one side of each display panel module overlaps a neighboring display panel module, and the surfaces of the display panel modules lie in the same line.

The invention discloses to a moisturizing method for increasing population density of bolboschoenus planiculmis, relates to a moisturizing method of bolboschoenus planiculmis population, and aims at solving the problem of low population density of existing bolboschoenus planiculmis. The method includes the steps of selection of fields, wherein through combination with vegetation investigation last year, a typical degenerated bolboschoenus planiculmis wetland is selected as a wetland to be recovered; selection of a water source, wherein a low-lying pool is selected as the water source; latticing treatment of the wetland to be recovered; manual moisturizing; moisturizing amount, wherein the moisture content of surface soil is remained within 45-55%; observation of vegetation growth. According to the moisturizing method, the emergence rate and survival rate of the bolboschoenus planiculmis population are ensured, moisturizing is conducted periodically and the population density change is monitored, and three weeks after moisturizing, the population density of bolboschoenus planiculmis the moisturizing amount of which is 45-55% soil moisture content is increased by 0.5-2.5 times than other treatment methods. The moisturizing method for increasing the population density of bolboschoenus planiculmis is used for recovery of the bolboschoenus planiculmis population.

Provided are a wafer level chip scale package of an image sensor and a manufacturing method thereof. The wafer level chip scale package includes: a wafer including an image sensor and a pad on the top surface thereof and inclined surfaces on both ends thereof; expansion pads formed on the inclined surfaces of the wafer, including the pad, such that the expansion pads are electrically connected to the pad, a bottom surface of the expansion pads being on a straight line with respect to that of the wafer; a support formed on the expansion pads to support both bottom surfaces of a glass, the support having a height to provide a space where an air cavity is formed; and a glass disposed on the support to provide the air cavity over the wafer.

The invention discloses an adjusting device specially for a steel hoop two-way suspension supporting system. The adjusting device comprises a base plate, a supporting sleeve, an adjusting blot arranged in the supporting sleeve, an adjusting nut matched with the adjusting bolt and a tray arranged at the end portion of the adjusting bolt. The base plate is further provided with a guide chute, and two clamping plates capable of sliding along the guide chute are arranged in the guide chute. The end portions (of the clamping plates) arranged out of two ends of the guide chute are in U-shaped hook-like structures, and the base plate is provided with fastening bolts for fixing the clamping plates on the base plate. The adjusting device specially for the steel hoop two-way suspension supporting system is fixed on longitudinal supporting beams of the supporting system through the clamping plates and the fastening bolts, supports a girder system concrete bottom die through the tray, and adjusts height of the tray through rotation of the adjusting nut, thereby resolving the problem of uneven height of the longitudinal supporting beams and guaranteeing that the tray can reliably support a structural girder system bottom die. After the girder system concrete reaches a die removing strength, the tray can be lowered by adjusting the adjusting nut, thereby being capable of conveniently demounting the girder system concrete bottom die.

The present invention provides a 800G silicon optical module which is reasonable in structural layout, the strength of a PCB (Printed Circuit Board) can still be ensured under the condition that the PCB with a standard design is adopted, meanwhile, the production cost is low, a slot is formed in the middle of the PCB to form a transmitting end arrangement area, a transmitting end component is arranged in the transmitting end arrangement area, and the transmitting end component is arranged in the transmitting end arrangement area. The metal heat sink is upwards attached to the transmitting end assembly from the lower surface of the PCB, the lower surface of the PCB is provided with a control chip and a receiving end assembly avoiding the metal heat sink, and the receiving end assembly comprises an optical fiber array, a silicon optical chip, an electric chip and a ceramic substrate which are sequentially arranged. The silicon optical chip, the electric chip and the ceramic substrate are bonded through gold threads, and the electric chip is installed on the PCB through a metal cushion block so that the electric chip, the silicon optical chip and the ceramic substrate can be arranged at the same height.

Using pressurized method or combining with grinding method can eliminate height difference among all metal lugs throughout piece of wafer, and on crystal grains at one process, so as to make all metal lugs possess same height substantially.