Housing, production method therefor and electronic device

A manufacturing method and housing technology, applied in the direction of electrical equipment shell/cabinet/drawer, electrical components, etc., can solve problems such as inability to properly polish and coat the surface, poor yield, and inability to remove

Active Publication Date: 2011-04-27
NEC PERSONAL COMPUTERS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] However, since the coating itself is self-healing and the coating film is soft and easy to move, it is not possible to properly polish the painted surface even with a polisher tha...

Method used

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  • Housing, production method therefor and electronic device
  • Housing, production method therefor and electronic device
  • Housing, production method therefor and electronic device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0036] The first embodiment is a method of manufacturing an electronic device case formed by integrally molding a self-healing surface-processed film and a resin.

[0037] figure 1 It is a partial cross-sectional view of an electronic device case manufactured by the manufacturing method of the first embodiment. refer to figure 1 , The electronic device casing manufactured by the manufacturing method of the first embodiment has a main body resin 10 , a film base layer 11 , and a self-healing layer 12 .

[0038] The main body resin 10 is a resin component that constitutes the shape of the electronic device housing, and is made of PLA (polylactic acid, polylactic acid), ABS (Acrylonitrile Butadiene Styrene, acrylonitrile-butadiene-styrene copolymer), PC (polycarbonate, poly Carbonate), PC / ABS alloy (alloy) and other resins.

[0039] The film base layer 11 is integrally molded with the main body resin 10 in a state where a predetermined decorative layer is attached. The film...

no. 2 Embodiment approach

[0048] image 3 It is a partial cross-sectional view of an electronic device case manufactured by the manufacturing method of the second embodiment. refer to image 3 , The electronic device casing manufactured by the manufacturing method of the second embodiment has a main body resin 10 and a self-healing layer 12 . The main body resin 10 and the self-healing layer 12 are made of the same materials as the main body resin 10 and the self-healing layer 12 constituting the case of the electronic device manufactured by the manufacturing method of the first embodiment.

[0049] Figure 4 It is a figure explaining the manufacturing method of 2nd Embodiment. refer to Figure 4 , the electronic device housing manufactured by the manufacturing method of the second embodiment, due to the figure 2 The production method of the first embodiment described in hereinafter is also produced by injection molding, so the description will focus on the differences.

[0050] First, if Figure...

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PUM

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Abstract

The invention provides a surface-finishing housing, a production method therefor and an electronic device, which is capable of effectively performing a self-healing performance. First, a film (300) is disposed between a first mold (100) and a second mold (200). Then gap injection housing material, adhesive film (300) and main resin (10) are formed during the mold clamping of the first mold (100) and the second mold (200) by a nozzle (210) formed on the second mold (200). The housing is made of main resin (10).

Description

[0001] This application claims the priority of Japanese Patent Application No. 2009-226665 (filing date: September 30, 2009), and the entire content thereof is described in this specification by reference. technical field [0002] The invention relates to a method for manufacturing a casing with self-healing properties, the casing and electronic equipment. Background technique [0003] In recent years, electronic devices such as notebook personal computers, mobile phones, PDAs (Personal Digital Assistants), and portable game consoles have been popularized, and opportunities for users to carry these electronic devices outside have increased. [0004] The above-mentioned electronic devices are often placed in bags held by users. In addition, keys, stationery, etc. are often put in the bag. Therefore, there are cases where the surface of the electronic device is damaged due to friction with the inner wall of the bag or other contents. [0005] In addition, since electronic de...

Claims

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Application Information

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IPC IPC(8): B29C45/14H05K5/00
Inventor 神尾俊聪
Owner NEC PERSONAL COMPUTERS LTD
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