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Lighting device

A technology for lighting devices and lighting devices, applied in lighting devices, parts of lighting devices, cooling/heating devices of lighting devices, etc., can solve problems such as overflow of LED chips, achieve balance of light emission, high-efficiency heat dissipation, and improve heat dissipation effect of effect

Active Publication Date: 2013-10-30
TOYODA GOSEI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] On the contrary, if the LED chip is to be arranged in the center of the light-emitting surface, there is a problem that the LED chip overflows from the first lead.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Next, the present invention will be described in more detail based on the embodiments.

[0052] figure 1 The light-emitting device 1 according to the embodiment is shown, (I) is a plan view, (II) is a cross-sectional view along line A-A, and (III) is a cross-sectional view along line B-B.

[0053] The light emitting device 1 includes an LED chip 3 and a package 10 .

[0054] GaN series light emitting diodes are used in the LED chip 3 . GaN series LEDs have an n-electrode and a p-electrode formed on one side of the chip, so as figure 1 As shown in (1), two welding wires W1 and W2 are erected.

[0055] In addition, in figure 1 In the example, the center of the LED chip 3 is not completely consistent with the center of the light emitting surface. However, if the centers of both are substantially coincident, there will be no problem during use of the light emitting device.

[0056] The package part 10 includes a first lead 11 , second leads 21 , 22 and a package re...

Embodiment 2

[0082] Figure 5 It is the figure which looked at the light-emitting device of Example 2 from obliquely above. The LED light-emitting device is composed of two leads 110 a and 110 b on the positive side and the negative side, a package 111 , face-up LED chips 112 a and 112 b , and a sealing resin 113 .

[0083] The package body 111 has a concave portion 114 . Leads 110 a , 110 b are arranged to face each other at a fixed interval through a resin material that is a part of package body 111 on the bottom surface of concave portion 114 . The opposing sides of the leads 110 a , 110 b are formed in straight lines perpendicular to the longitudinal direction of the recess 114 . Also, near the opening on the side surface of the concave portion 114, a groove 114a for preventing peeling of the sealing resin 113 is provided. Furthermore, the side surface 114b of the concave portion 114 has an inclination in which the cross-sectional area on a surface parallel to the bottom surface of ...

Embodiment 3

[0093] Figure 9 It is the figure which observed the LED light emitting device of Example 3 from obliquely above. The LED light-emitting device of Embodiment 3 is square in plan view, and consists of two lead wires 130a and 130b on the positive side and the negative side, a package body 131, six face-up LED chips 132, and an encapsulation resin 133.

[0094] The package body 131 has a concave portion 134 . The lead wires 130a and 130b are arranged on the bottom surface of the concave portion 134 . The leads 130 a and 130 b are arranged to face each other at a fixed distance through a resin material which is a part of the package body 131 . The respective opposing sides 130aa and 130ba of the leads 130a and 130b are straight lines parallel to one side of the concave portion 134 . Further, grooves 134 a for preventing peeling of the encapsulating resin 133 are provided in the vicinity of the opening on the side surface of the concave portion 134 . In addition, the side surfa...

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PUM

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Abstract

The present invention provides a light emitting device. The light emitting device is provided with an adhibition area of an LED chip on a first lead and is provided with a welding area of a lead from the LED chip on the second lead. Two leads are surrounded by a packaging resin part. Excellent light emitting equilibrium and heat radiating performance are kept when the light emitting surface of the light emitting device is a smaller square. Furthermore, a part which is opposite with the second lead in the first lead (11) forms a thin-wall part (13). The LED chip (3) is adhibited on the surface side of the thin-wall part (13). Furthermore the resin material of the packaging resin part (31) flows into the back side of the thin-wall part (13).

Description

technical field [0001] The present invention relates to improvements in lighting devices. Background technique [0002] High luminance is required for LED chips mounted in lighting devices. When the LED chip realizes high brightness, the heat generated by the LED chip becomes a problem. Therefore, conventionally, various improvements for promoting heat dissipation have been performed on lighting devices. [0003] For example, in Figure 12 and Figure 13 In the illustrated lighting device 50 , heat dissipation is improved by enlarging the exposed area of ​​the leads of the LED chip 53 . In this lighting device 50 , a first lead 54 on which an LED chip 53 is mounted on the surface, and second leads 55 and 56 provided on the surface with a bonding area for bonding the wire W2 from the LED chip 53 are used. Further, the leads 54 , 55 , 56 are integrally surrounded by the encapsulating resin 57 , and an insulating region 58 is formed between the opposing surfaces of the firs...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S2/00F21V19/00F21V29/00F21V7/00F21V29/10
CPCH01L2224/48091H01L2224/48247H01L2224/48257H01L2224/73265
Inventor 林稔真国分英树出向井幸弘福井康生
Owner TOYODA GOSEI CO LTD