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Wafer sorting technique

A classification method and wafer technology, applied in sorting and other directions, can solve the problems of low output efficiency and long time, and achieve the effect of improving production efficiency, timely control and adjustment

Inactive Publication Date: 2011-05-04
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Abstract
  • Description
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Problems solved by technology

[0006] In view of this, the technical problem solved by the present invention is: the waiting time for the CP test is relatively long, and the output efficiency is relatively low

Method used

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Embodiment Construction

[0033] The core idea of ​​the present invention is: based on CP data and WAT data usually have a strong correlation, use the method of statistics and database mining to set out from historical CP data and WAT data, utilize the WAT data of unknown sample, the CP of this unknown sample The data is predicted to achieve the purpose of classifying unknown samples into good and bad wafer groups. By adopting the technical solution of the present invention, the unknown samples with known WAT data can be accurately grouped without CP testing, which not only improves the production efficiency, but also can control and adjust the wafer process in time.

[0034] In order to make the object, technical solution, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and examples.

[0035] Schematic flow chart of the method for classifying wafers in the present invention, as figure 1 shown....

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Abstract

The invention discloses a wafer sorting technique. In the sorting technique, a batch of known wafers are provided; the known wafers are the wafers with WAT data and CP data and are divided into good and bad groups; WAT parameters are screened from the WAT data of the known wafers; the screened WAT parameters are subject to orthogonal analysis to obtain principal components which are selected; an unknown wafer is provided; the unknown wafer is one wafer which is provided with WAT data and not provided with CP data; the unknown wafer is represented by using the selected principal components; the good group and the bad group are respectively represented by using the selected principal components; the unknown wafer, the good group and the bad group which are respectively represented by the selected principal components are substituted into a discriminatory analysis formula so as to calculate the distances from the unknown wafer to the good and bad groups; and the unknown wafer is sorted to the group which is closer to the unknown wafer. The wafer sorting technique is used to exactly sort the unknown wafer without performing a CP test.

Description

technical field [0001] The invention relates to the field of semiconductor testing, in particular to a method for classifying wafers. Background technique [0002] Currently, there are two types of electrical testing during silicon wafer manufacturing, so called silicon testing because they are performed on silicon wafers (rather than packaged chips). Wafer testing is divided into Wafer Acceptance Test (WAT, Wafer Acceptance Test) and Wafer Probe (CP, Circuit Probe). [0003] WAT is carried out after the silicon wafer is manufactured. It is an electrical test for the test pattern structure on the silicon wafer. The electrical parameters are used to monitor whether the process of each step is normal and stable. [0004] CP is also performed after wafer fabrication, but CP testing is performed after WAT testing. Each die is tested across the entire wafer to determine which dies on the wafer meet specifications and can be sent to the assembly and packaging department. That i...

Claims

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Application Information

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IPC IPC(8): B07C5/344B07C5/38
Inventor 林光启刘伟
Owner SEMICON MFG INT (SHANGHAI) CORP
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