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Peeling jig of dust-proof film assembly and peeling method

A technology for dust-proof film components and fixtures, applied in electrical components, components for opto-mechanical processing, semiconductor/solid-state device manufacturing, etc., can solve the problems of high risk of photomasks and poor production efficiency

Inactive Publication Date: 2011-05-11
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the device tends to be larger
Therefore, until now, the method of carefully peeling off the pellicle while pressing it by hand is still the mainstream, but the risk of damage to the photomask is still high, and the production efficiency is very poor.

Method used

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  • Peeling jig of dust-proof film assembly and peeling method
  • Peeling jig of dust-proof film assembly and peeling method
  • Peeling jig of dust-proof film assembly and peeling method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0065] Examples of the present invention will be described below, but the present invention is not limited thereto.

[0066] A pellicle peeling jig having the structure shown in Fig. 1 was produced. The base 13 is made into a frame shape with a pressed hollow material of A6063 aluminum alloy with a cross-section of 30mm×30mm, and the first arm 14a and the second arm 14b made of antistatic ultra-high molecular polyethylene are mounted on both ends . A screw member 14c made of antistatic MC nylon is attached to the second arm portion 14b. In addition, a handle 15 made of antistatic resin is attached to the base 13 .

[0067] Then, under the base 13, a base member 17 made of antistatic PVC is provided. Then, apply a silicone adhesive (trade name KR3700 / manufactured by Shin-Etsu Chemical Co., Ltd.) on both sides of a PET film with a thickness of 100 μm, and make the film thickness after drying to 50 μm. After heating and curing, it is cut into base members 17 shape, attached t...

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PUM

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Abstract

The invention provides a peeling jig of a dust-proof film assembly and a peeling method. The peeling jig of the dust-proof film assembly comprises a fixing member for a mask and an adhesive layer for the dust-proof film assembly. The relative position of the mask and the dust-proof film assembly is fixed and then the adhesive layer is pulled out and removed. According to the invention, a dust-proof film assembly attached to a mask is removed simply and safely.

Description

technical field [0001] The present invention relates to a pellicle used as a dust preventer in the manufacture of products such as semiconductor devices, printed circuit boards, and liquid crystal displays. Background technique [0002] In the manufacturing process of semiconductor devices such as LSI and super LSI or products such as liquid crystal displays, semiconductor wafers or original plates for liquid crystals are irradiated with light to form patterns, but the photomasks such as shrink masks used at this time If dust adheres, since the dust absorbs light and reflects light, not only will the transferred pattern be deformed and the edges will be roughened, but also the base will be stained black, and the size, quality, and appearance will be damaged. [0003] Therefore, these operations are usually performed in a clean room, but even so, it is still quite difficult to keep the mask clean. Therefore, a pellicle assembly is attached on the surface of the photomask as ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/14H01L21/687G03F1/62G03F1/64H01L21/027
CPCG03F1/62G03F1/64G03F1/66H01L21/0274
Inventor 关原一敏
Owner SHIN ETSU CHEM IND CO LTD
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