Method and structure for molding leadframe strip
A lead frame strip and lead frame technology is applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., and can solve the problems of difficult output per unit time, waste of lead frame strip 1 space, etc.
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[0031] In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments of the present invention are exemplified below and described in detail in conjunction with the accompanying drawings. Furthermore, the directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside" or "side", etc., It is only for orientation with reference to the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.
[0032] Please refer to image 3 and 4 As shown, the sealing method and sealing structure of lead frame strips according to the first embodiment of the present invention are mainly used in the manufacture of semiconductor packaging products with four rows of lead frames, for example, in the manufacture of quad flat packages (quad flat packages, QFP), square fla...
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