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Heat radiating device with foolproof structure and electronic device with same

A technology for heat sinks and electronic devices, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of burning out electronic components, affecting the normal operation of electronic components, weakening the heat dissipation efficiency of the radiator, and avoiding installation errors. Effect

Inactive Publication Date: 2011-05-11
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When installing the radiator, due to misoperation, especially for non-professionals who do not know how to install it correctly, it is easy to install the radiator on the circuit board in the wrong direction, so that the airflow generated by the fan cannot flow smoothly The flow channels between the heat sinks will seriously weaken the heat dissipation efficiency of the heat sink, affect the normal operation of electronic components, and even cause electronic components to burn out due to overheating

Method used

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  • Heat radiating device with foolproof structure and electronic device with same
  • Heat radiating device with foolproof structure and electronic device with same
  • Heat radiating device with foolproof structure and electronic device with same

Examples

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Embodiment Construction

[0013] Such as figure 1 and figure 2 As shown, the electronic device 100 of the present invention includes a circuit board 10 , an electronic component 20 , a heat dissipation device 30 , several locking pieces 40 and a fan 50 .

[0014] The electronic component 20 is disposed on the circuit board 10 , and the circuit board 10 is provided with four mounting holes 11 arranged in a square around the electronic component 20 . The mounting hole 11 is circular, and the edge of one of the mounting holes 11 is provided with two opposite gaps 111 ( Figure 4 shown).

[0015] The heat dissipation device 30 includes a radiator 31 , four supporting sleeves 32 and a positioning sleeve 33 . The heat sink 31 is pasted on the electronic component 20 to dissipate heat. The heat sink 31 includes a square substrate 311 and a plurality of cooling fins 312 disposed on the substrate 311 . The cooling fins 312 are integrally extended vertically upward from a top surface of the substrate 311 ,...

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Abstract

The invention discloses a heat radiating device with a foolproof structure, which is used for radiating heat of an electronic component on a circuit board and comprises a heat radiator, at least one first supporting sleeve, a second supporting sleeve and a locating sleeve. The heat radiator comprises a basal plate and a plurality of heat radiating fins arranged on the basal plate; the first supporting sleeve and the second supporting sleeve are fixedly arranged at the lower side of the basal plate of the heat radiator; the locating sleeve is used for fixing with the circuit board; the foolproof structure is formed by the second supporting sleeve and the locating sleeve and is respectively provided with a first combining part and a second combining part on the second supporting sleeve and the locating sleeve; and the first combining part and the second combining part of the foolproof structure are combined to prevent the heat radiating device being installed on the circuit board by mistake in direction. The invention also relates to an electronic device with the heat radiating device.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device with a fool-proof structure and an electronic device using the heat dissipation device. Background technique [0002] At present, in an electronic device (such as a computer case), in order to quickly dissipate the heat emitted by the electronic components (such as the central processing unit (CPU) on the mainboard) on the circuit board in the case, a A radiator is installed on the electronic component. The heat sink includes a base plate and a plurality of cooling fins arranged on the base plate. The base plate is provided with a number of mounting holes for a plurality of locking pieces to pass through the mounting holes respectively, so that the heat sink is fixed to the circuit board and the The heat sink fits the electronic components. The heat generated by the electronic components can be dissipated through the radiator so that the electronic componen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/34H01L23/40G06F1/20
CPCG06F1/20H01L23/4093H01L2924/0002H01L2924/00
Inventor 汤贤袖叶振兴
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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