Unlock instant, AI-driven research and patent intelligence for your innovation.
Environmentally friendly lead-containing solder capable of suppressing lead from volatilizing at high temperature
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
An environmentally friendly, high-temperature technology, applied in the direction of manufacturing tools, welding/cutting media/materials, welding media, etc., to achieve the effect of safe and convenient use, good environmental conditions, and no impact on health
Inactive Publication Date: 2013-11-13
CHONGQING UNIV OF TECH
View PDF1 Cites 0 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
This covering agent is mainly used for lead bath quenching of steel wire, not suitable for electronic brazing
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0024] Example 1: Put 630g of Sn and 370g of Pb in an open electric furnace for oxidation refining and boiling refining, then pour into a closed converter, add 0.5g of Al, 0.01g of Ni, and 0.005g of Ga for modification and refining, and the obtained The solder is heated to 800°C at a rate of 10°C per minute under a protective atmosphere, and it is measured that the volatilization of lead is 65% lower than that of Sn-37Pb.
Embodiment 2
[0025] Example 2: Put 620g of Sn, 360g of Pb, and 20g of Ag in an open electric furnace for oxidation refining and boiling refining, then inject into a closed converter, add 0.1g of Al, 1.5g of Bi, and 0.05g of In to improve The resulting solder is heated to 800°C at 10°C per minute under a protective atmosphere, and the measured lead volatilization is 72% lower than that of Sn-37Pb.
Embodiment 3
[0026] Example 3: Put 550g of Sn, 430g of Pb, and 20g of Sb in an open electric furnace for oxidation refining and boiling refining, then inject into a closed converter, add Ni 0.5g, P 0.05g, and Ti 0.005g to improve The resulting solder is heated to 800°C at 10°C per minute under a protective atmosphere, and it is difficult to detect the volatilization of lead.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
PUM
Login to View More
Abstract
The invention provides an environmentally friendly lead-containing solder capable of suppressing lead from volatilizing at high temperature, which is used in the electronic industry. The lead-containing solder comprises the following components: 0-4.0 percent by weight of Ag, 0-3.0 percent by weight of Sb, one or more of Ni, Al, Bi, Ca, In, P and Ti and the balance of Sn and Pb, wherein the quantity of each of the Ni, the Al, the Bi, the Ca, the In, the P and the Ti is 0.0001-0.2 percent by weight; the total quantity of the elements of the Ni, the Al, the Bi, the Ga, the In, the P, the Ti, and the like does not exceed 0.3 percent by weight at most; and the elements can form various better combinations, such as the combination of Ni and P, the combination of Ni, P and Ti and the combination of Ni, P and Ga, or only the elements of the Ni, the Al, and the like are selected. In the invention, after the solder is molten, a surface modification film can be automatically generated and can obviously suppress the volatilization of the lead at high temperature, and the solder has good environment condition in a using process, has no influence on the health of operators, is safe and convenient to use and has low cost, thus the solder is a new-generation micro-connection material used for environmentally friendly manufacturing an electronic product.
Description
[0001] The present invention is a divisional application of the invention patent application with application number 200810069745.8. technical field [0002] The invention relates to a lead-containing solder used in the electronics industry to inhibit lead from volatilizing and polluting the environment at high temperatures. Background technique [0003] For a long time, lead-containing solder has been widely used as electronic soldering material due to its low cost and excellent performance. Since lead pollutes the environment, the world has started research on lead-free electronic solder since the 1990s, but up to now, a kind of lead-free solder with comprehensive performance comparable to that of Sn-Pb solder has not been found, and there is no Find a comprehensive solution to replace Pb. In many electronic devices, it is difficult to truly realize lead-free because the reliability of lead-free solder cannot be guaranteed. Therefore, in the future, electronic solder wil...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to View More 
Login to View More