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Image sensor module, method of manufacturing same, and image processing system including image sensor module

An image sensor and image signal processing technology, applied in image communication, picture signal generators, components of TV systems, etc., can solve problems affecting CMOS image sensors, etc.

Active Publication Date: 2015-06-03
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, when the CMOS image sensor and ISP are implemented on one chip using one substrate, digital noise generated in the ISP may affect the CMOS image sensor

Method used

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  • Image sensor module, method of manufacturing same, and image processing system including image sensor module
  • Image sensor module, method of manufacturing same, and image processing system including image sensor module
  • Image sensor module, method of manufacturing same, and image processing system including image sensor module

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Embodiment Construction

[0066]Example embodiments of the invention will be described more fully hereinafter with reference to the accompanying drawings, in which example embodiments are shown. However, this invention can be embodied in many different ways and should not be construed as limited to the embodiments set forth in this specification. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals denote the same elements throughout.

[0067] Therefore, while the example embodiments are susceptible to various modifications and alternatives, embodiments thereof are illustrated by way of example in the drawings and described in detail in the specification. It should be understood, however, that there is no intention to limit example embodiments to the particul...

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Abstract

An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.

Description

[0001] Cross References to Related Applications [0002] This application claims Korean Patent Application No. 10-2009-0125412 filed with the Korean Intellectual Property Office (KIPO) on Dec. 16, 2009, No. 10-2010-0000266 filed on Jan. 04, 2010, and Priority of No. 10-2010-0052290 filed on March 03, the entire contents of which are incorporated into this application by reference. technical field [0003] The present invention relates to an image sensor module, and more particularly, to an image sensor module including an image sensor chip and an image signal processing chip, a method of manufacturing the image sensor, and an image processing system including the image sensor module, wherein the image sensor Chips and image signal processing chips are fabricated using complementary metal-oxide-semiconductor (CMOS) processes with different minimum feature sizes. Background technique [0004] Image sensors may be roughly divided into charge-coupled device (CCD) image sensors ...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146H04N5/225H04N5/345H04N9/04G03B17/12G03B30/00H04N23/40H04N25/00
CPCH01L2224/16225H01L2224/48091H01L2224/48227H01L2924/12044H01L27/14618H04N23/57H04N25/443H04N25/70H04N25/79H04N23/843H04N25/78H04N25/76H01L2924/00014H01L2924/00H04N23/69H04N25/75
Inventor 李润泰林埈绪李济硕朴宰用朴埈佑李秀永
Owner SAMSUNG ELECTRONICS CO LTD