LED illumination light source encapsulation structure and manufacturing method thereof
A technology of LED lighting and packaging structure, applied in lighting devices, cooling/heating devices of lighting devices, parts of lighting devices, etc., can solve the problems of reduced service life of lamps and low heat dissipation efficiency, and achieve thermal resistance reduction, Good cooling effect and simple process
Inactive Publication Date: 2011-08-03
SHANGHAI SANSI ELECTRONICS ENG +2
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Problems solved by technology
Because there is an insulating layer with a very low thermal conductivity and thermal grease on this heat conduction path, it will cause a large thermal resistance, making the overall heat dissipation efficiency low, which will inevitably lead to a decrease in the service life of the lamp
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[0024] figure 1 It is a schematic diagram of the packaging structure of the LED lighting source in the prior art, and the figure shows the way the heat generated by the LED chip 1 is transferred to the heat dissipation base 2 . The heat generated by the LED chip 1 is transferred to the copper clad layer 3, insulating layer 4, aluminum base layer 5, thermal conductive silicone grease 6 on the aluminum substrate in turn through its positive and negative pins 11, 12 and the heat sink 13 at the bottom, and finally to the on the cooling base 2.
[0025] Figure 2 ~ Figure 3 As shown, in the packaging structures of the LED lighting sources of the two embodiments of the present invention, the LED chip 1 is installed on one end surface of the heat dissipation base 2 . When the LED chip 1 belongs to the thermoelectric separation type or the thermoelectric non-separation type in which the bottom heat sink is connected to the positive pin, its negative pin 12 is welded on the copper sh...
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The invention discloses a light emitting diode (LED) illumination light source encapsulation structure and a manufacturing method thereof. The structure comprises an LED chip and a radiating base for mounting the LED chip, wherein a heat sink and positive and negative electrode pins at the bottom of the LED chip are welded on different copper sheets respectively; the copper sheets on which the positive and negative electrode pins of the LED chip are welded are provided with electrically connected parts respectively; and the copper sheets are embedded into an insulation heat conduction material arranged on the upper end face of the radiating base. The manufacturing method of the LED illumination light source encapsulation structure comprises the following steps of: coating a thin layer of insulation heat conduction material on the upper end face of the radiating base; cooling and solidifying the material; injecting the insulation heat conduction material; embedding the copper sheets into the insulation heat conduction material; and cooling and solidifying. By the LED illumination light source encapsulation structure and the manufacturing method thereof, radiating efficiency can be improved; and the encapsulation structure is simple and has a simplified production process and high performance.
Description
technical field [0001] The present invention relates to the field of lighting, and further relates to a packaging structure using LED as a light source and a manufacturing method thereof. Background technique [0002] As a light source, LEDs are more and more commonly used in the field of lighting, but due to the limitations of the LED chip production process and materials, it generates a large amount of heat energy in the process of converting electrical energy into light energy, so the application of LED as a light source for lighting fixtures , how to solve the heat dissipation is the first problem that needs to be considered and solved. The traditional method is to solder the LED chip on a layer of aluminum substrate, which is commonly referred to as a PCB board. The aluminum substrate generally includes a copper clad layer, an insulating layer and an aluminum base layer. Then, the aluminum substrate is bonded on a heat dissipation base through thermal conductive silic...
Claims
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IPC IPC(8): F21V19/00F21V23/06F21V29/00H01L33/62H01L33/64F21Y101/02F21V29/70F21Y115/10
Inventor 陈必寿陈春根李晟
Owner SHANGHAI SANSI ELECTRONICS ENG