Flat heat radiating pipe and manufacturing method thereof

Abstract

The invention discloses a flat heat radiating pipe which comprises a pipe cavity with two closed ends and a pipe wall enclosing the pipe cavity along the axial direction, wherein the pipe wall comprises arc walls positioned at two sides and a flat wall for connecting the arc walls, the pipe cavity and the pipe wall are sequentially defined as an evaporation section, a heat insulation section and a condensation section along the axial direction; the pipe cavity is internally provided with a main capillary structure and an auxiliary capillary structure, wherein the main capillary structure is in contact with the flat wall of the evaporation section or in contact with the flat walls of the evaporation section and the heat insulation section; the auxiliary capillary structure is in contact with the arc wall positioned at least one side, the pipe cavity between the main capillary structure and the auxiliary capillary structure is filled with a working medium; and a main gas channel of a heat radiating pipe has enough space so that capillary force of the flat heat radiating pipe is improved and conveying capacity of the working medium is increased, and thus heat transfer efficiency of the flat heat radiating pipe is increased. The invention also provides a manufacturing method of the flat heat radiating pipe.

Description

technical field [0001] The invention relates to heat dissipation technology, in particular to a flat heat dissipation pipe and a manufacturing method thereof. Background technique [0002] Today's electronic products tend to develop in the direction of thinner, thinner and smaller. The heat dissipation problem of electronic products in the ever-shrinking space becomes more and more important. This requires heat dissipation products to have higher heat transfer and heat dissipation performance while becoming thinner and smaller. [0003] Due to the advantages of high heat transfer, heat pipes have been widely used in electronic components with large heat generation. When the heat pipe is working, the low-boiling-point working medium filled inside the heat pipe absorbs the heat generated by the heating electronic components in the evaporation section of the heat pipe, evaporates and vaporizes, and moves to the condensation section with heat through the adiabatic section, and l...

AI Technical Summary

Problems solved by technology

[0006] The problem solved by the present invention is that the heat dissipation pipe adopts a single capillary structure. When the heat dissipation pipe is flattened, the capillary structure is prone to deformation and disintegration, which greatly reduces the working medium delivery capacity of the entire heat dissipation pipe. Sufficiently supplemented, resulting in a substantial decrease in the maximum heat transfer of the heat pipe and an increase in thermal resistance

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