Flat type radiating pipe and manufacturing method thereof

Abstract

The invention discloses a flat type radiating pipe and a manufacturing method thereof. The flat type radiating pipe comprises a tube cavity with two closed ends and a tube wall axially surrounding the tube cavity; the tube cavity and the tube wall are axially provided with an evaporation section, a heat insulation section and a condensation section sequentially; the tube cavity is internally provided with a main capillary structure and an auxiliary capillary structure, wherein the main capillary structure contacts with the tube wall of the evaporation section and extends to the heat insulation section of the tube cavity; the auxiliary capillary structure contacts with the tube walls of the heat insulation section and condensation section; in the heat insulation section of the tube cavity,the auxiliary capillary structure is partially covered by the main capillary structure; and a working medium is filled in the tube cavity enclosed by the main capillary structure and the auxiliary capillary structure. The flat type radiator can be used for solving the ponding problem occurring after the radiating pipe is beaten to be very thin; the capillary force of the flat type radiator is improved, the working medium conveying ability is enhanced, and the backflow efficiency of the working medium is improved; and moreover, the composite capillary structure ensures that the heat transfer performance of the radiating pipe is greatly improved, thus the heat transfer efficiency of the flat type radiating pipe is enhanced.

Description

technical field [0001] The invention relates to heat dissipation technology, in particular to a flat heat dissipation pipe and a manufacturing method thereof. Background technique [0002] Today's electronic products tend to develop in the direction of thinner, thinner and smaller. The heat dissipation problem of electronic products in the ever-shrinking space becomes more and more important. This requires heat dissipation products to have higher heat transfer and heat dissipation performance while becoming thinner and smaller. [0003] Due to the advantages of high heat transfer, heat pipes have been widely used in electronic components with large heat generation. When the heat pipe is working, the low-boiling-point working medium filled inside the heat pipe absorbs the heat generated by the heating electronic components in the evaporation section of the heat pipe, evaporates and vaporizes, and moves to the condensation section with heat through the adiabatic section, and l...

AI Technical Summary

Problems solved by technology

[0007] The problem solved by the present invention is that the heat dissipation pipe adopts a single capillary structure. When the heat dissipation pipe is flattened, the maximum heat transfer of the heat dissipation pipe will drop significantly and the thermal resistance will increase; the heat dissipation pipe will easily form water accumulation in the heat insulation section and the condensation section

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