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Control and monitoring system for thin die detachment and pick-up

一种晶粒、预剥离的技术，应用在半导体/固态器件制造、半导体/固态器件测试/测量、电气元件等方向，能够解决不适合晶粒等问题

Active Publication Date: 2011-08-10
ASM ASSEMBLY AUTOMATION LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, for larger die sizes, the ejector pins placed on the outer edge of the die prevent the separation from spreading toward the center of the die
Therefore, traditional die picking tools using ejector pins may not be suitable for detaching thin die from adhesive tape

Method used

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  • Control and monitoring system for thin die detachment and pick-up
  • Control and monitoring system for thin die detachment and pick-up
  • Control and monitoring system for thin die detachment and pick-up

Examples

Experimental program
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Effect test

Embodiment Construction

[0022] Here, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0023] Figures 3A to 3C shown using figure 2 Schematic diagram of the pick-up process of the die 12 in the die separation and pick-up tool 10 . Die 12 has been aligned to the center of ejector cover 16 and clip 20 has been moved to contact the surface of die 12 . Vacuum suction is applied to the interior of the ejector cover 16 and clip body 20 to secure the adhesive tape body 18 supporting the die 12 . All mobile support plates 14 are moved to the pre-peeling level, H, as Figure 3A As shown, where the initial grain separation occurs at the edge of the grain 12. The mobile support plate 14 includes a central plate C and at least one pair of outer plates L2 , R2 disposed on opposite sides of the central plate, which are disposed adjacent to each other to form a continuous surface to support the inside and outside of the die 12 . During die detachm...

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PUM

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Abstract

The invention discloses a method for separating the die from an adhesive tape. During detachment of the die from the adhesive tape, the inner and outer portions of a first side of the die which is in contact with the adhesive tape is supported with a support surface. A collet contacts the inner and outer portions of a second side of the die opposite to the first side. Support is withdrawn from the outer portion of the die such that the outer portion of the second side of the die bends away from the collet while the support surface only supports the inner portion of the die. Vacuum suction from the collet is applied to attract the outer portion of the die towards the collet and the vacuum suction pressure is monitored until a threshold pressure is reached indicating that the outer portion of the die is contacting the collet. Thereafter, the collet is lifted while holding the die with vacuum suction to completely separate the die from the adhesive tape.

Description

technical field [0001] The present invention relates to the handling of semiconductor chips or semiconductor dies in semiconductor assembly and packaging processes, and more particularly to a feedback control system for realizing separation and pick-up of semiconductor dies from semiconductor dies mounted thereon The semiconductor crystal grains can be peeled off controllably at the adhesive tape body. Background technique [0002] Typically during dicing, a wafer containing a large number of semiconductor dies is mounted on an adhesive tape, wherein each individual die is separated while it is attached to the adhesive tape. Therefore, separating and picking up the die from the adhesive tape is an important operational step in the die-bonding and flip-chip bonding processes to assemble electronic packages. [0003] When the die thickness decreases below 4 mils (approximately 100 microns), separating the die from the adhesive tape becomes a challenging task without damaging ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/66H01L21/00
CPCH01L21/50Y10S156/943Y10S156/931Y10S156/932Y10S156/941H01L21/6838H01L21/67132Y10T156/1132Y10T156/1142Y10T156/1168Y10T156/1195Y10T156/1944Y10T156/1978Y10T156/1989Y10T156/1994H01L21/30H01L21/78
Inventor 叶少萍庄智明陈文炜黄国威
Owner ASM ASSEMBLY AUTOMATION LTD
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