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Electrical connecting component comprosing a hotmelt element, method and tool for manufacturing such an electrical component

A technology of electrical components and components, which can be applied to the components of connecting devices, circuit/collector components, electrical components, etc., and can solve problems such as obstacles to development of power

Inactive Publication Date: 2015-01-21
TYCO ELECTRONICS NETHERLAND BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is a hurdle in adopting previous momentum towards higher data transfer rates

Method used

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  • Electrical connecting component comprosing a hotmelt element, method and tool for manufacturing such an electrical component
  • Electrical connecting component comprosing a hotmelt element, method and tool for manufacturing such an electrical component
  • Electrical connecting component comprosing a hotmelt element, method and tool for manufacturing such an electrical component

Examples

Experimental program
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Embodiment Construction

[0039] First, refer to figure 1 The configuration of the electrical component 1 according to the present invention is explained.

[0040] The electrical component 1 comprises at least one cable element and the cable element 2 correspondingly comprises at least one electrically conductive member 4 such as a lead of electrically conductive material. Typically, at least one conductive member is enclosed in an insulating cladding 6 , which also surrounds an electromagnetic shielding layer, not shown, to shield off electromagnetic radiation from the conductive member 4 .

[0041] The cable element 2 is mechanically and electrically connected to the substrate element 8 . The connection can be produced by connecting the at least one electrically conductive component 4 and the at least one electrical component 10 of the substrate element, in particular by means of a solder joint 12 on the upper surface 13 of the substrate element 8 . The number of solder joints 12 corresponds to the...

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PUM

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Abstract

The invention relates to an electrical component (1) comprising at least one cable element (2), at least one solder joint (12), at least one hotmelt element (22) and at least one substrate element (8). The cable element (2) is connected with the substrate element (8) by the solder joint (12). To improve the data transmission rate, the at least one solder joint (12) is not embedded in the hotmelt element (22). Preferably, the solder joint (12) is free from the hotmelt material of the hotmelt element (22). The invention is also concerned with a method of manufacturing such an electrical component (1). According to the inventive method, a flow of hotmelt material (22) is stopped before it reaches the solder joint (12). Finally, the invention is concerned with providing a tool (50) for manufacturing the electrical component (1). Here, a hotmelt cavity (70) for forming the hotmelt element (22) from hotmelt material is separated from a substrate cavity (64) adapted to receive the substrate element (8) by a compressible solder sealing (84).

Description

technical field [0001] The invention relates to an electrical component comprising at least one cable element, at least one solder joint, at least one hot-melt element and at least one substrate element, said cable element comprising at least one electrically conductive member, said substrate element comprising a At least one electrical member electrically connected to the conductive member. [0002] The invention also relates to a method for manufacturing an electrical component comprising: at least one cable element with at least one electrically conductive member, at least one hot-melt element and at least one substrate element with at least one electrical member; said method comprising the steps What is claimed is: connecting at least one conductive member to at least one substrate element by a solder joint; causing molten hot melt material to flow onto at least one of the cable element and the conductive member in a region adjacent to the substrate element. [0003] Fina...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/02H01R13/58H01R13/66H01R24/00H01R43/00
CPCH01R13/506H01L2924/0002H01R9/032H01R13/6658H01R13/65912H01L2924/00
Inventor 格特·范蒂尔简·范蒂尔伯格
Owner TYCO ELECTRONICS NETHERLAND BV
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