Driving device and imaging device

Abstract

Provided is a driving device having a rod-like terminal capable of stably fixing an SMA and connecting a conductive member without preventing the size of the driving device from being reduced and affecting the performance of the SMA. Also provided is an imaging device. The driving device is equipped with a string-shaped shape-memory alloy as a driving source and includes: a base member serving as the base of the driving device; and the rod-like terminal made of a metal penetrating the base member and secured to the base member. One end side of the rod-like terminal is caulked to interpose and hold the shape-memory alloy, and the other end side of the rod-like terminal has a crimp portion where the conductive member for supplying current to the shape-memory alloy is crimped and fixed.

Description

technical field [0001] The present invention relates to a driving device and an imaging device, and more particularly, to a driving device and an imaging device including a rod-shaped terminal for connecting a shape memory alloy to a conductive member. Background technique [0002] In recent years, attempts have been made to use actuators having shape memory alloys (hereinafter also referred to as SMAs) in various driving devices. SMA is represented by alloys of titanium and nickel, etc., and is an alloy that has the property that even if it deforms below a temperature called a transformation point, it undergoes a martensitic transformation when heated above this temperature. and return to its original shape. Generally, the SMA is formed in a rope-like form, and operates as an actuator by expanding and contracting in the longitudinal direction by energized heating control. [0003] The wire diameter of this SMA is as thin as several tens of μm, so it can realize the miniat...

AI Technical Summary

Problems solved by technology

[0009] However, in the method disclosed in Patent Document 1, the clamping surface for clamping and fixing the SMA by crimping and the washer member for connecting the lead wires are integrated in a planar shape, so a relatively complex structure is required. Large two-dimensional space for configuration, which may hinder the miniaturization of the device

[0010] In addition, in the method disclosed in Patent Document 2, the holes of the base member for fixing the SMA and the terminals for soldering wires are arranged close to each other, so the performance of the SMA may be affected by heat conduction during the soldering operation.

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