Processing method and device for carrying out microwave cutting on brittle material
A technology of brittle materials and processing methods, applied in auxiliary devices, metal processing equipment, welding/cutting auxiliary equipment, etc., can solve difficult problems such as non-metallic material cutting work, and achieve simple and easy implementation methods and devices, and ensure energy Density, the effect of ensuring the edge of the cut and the quality of the workpiece
Inactive Publication Date: 2014-07-16
HARBIN INST OF TECH
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Problems solved by technology
[0007] Plasma cutting: plasma arc has achieved good results in cutting non-metallic brittle thin materials such as ceramics, but limited by the arc column shape and temperature field distribution, it is difficult to cut non-metallic materials with large thickness
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[0034] The present invention is suitable for cutting and processing brittle materials at room temperature. The processing device for microwave cutting brittle materials in the figure mainly includes a magnetron and its processing positioning observation optical system 4, a tapered waveguide mode converter for focusing microwaves, and a changing Magnetron power change system for microwave output power 3. Clamp body for maintaining the material to be processed 7. X-axis guide rail 9 for brittle materials to achieve predetermined trajectory movement, Y-axis guide rail 11, Z-axis guide rail 13, workbench 10, pair The microwave emitting device for local heating of the brittle material 6 clamped by the clamp body 7, the protective plate 1 for shielding microwave radiation, the lighting equipment 14 inside the processing device, and the thermal imager 12 for detecting the temperature field of the heated material.
[0035] The protective plate 1 is connected to the angle iron frame 1 b...
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Abstract
The invention relates to a processing method for carrying out focused microwave cutting on a brittle material, which is characterized in that microwave energy high-density focusing is realized by using a tapered waveguide, and microwave beams are emitted to the surface of a workpiece from the front end of the tapered waveguide in a high energy density beam mode so as to heat the workpiece, thereby realizing the cutting processing according to the principle of a hot cracking method. The waveguide comprises a cone-shaped mode converter by which the microwave focusing can be realized; and the processing device is provided with a three-dimensional operating platform by which the processing requirements of any curve can be realized. The invention also relates to a processing device for carrying out microwave cutting on a brittle material by using the processing method.
Description
technical field [0001] The invention relates to a method for cutting and processing brittle materials by changing the microwave spot area through a waveguide, wherein the microwave beam is aimed at the surface of the workpiece and the workpiece is processed at the working point. The invention also relates to a device for processing the workpiece by the microwave beam. Background technique [0002] Brittle materials have less deformation before fracture, lower plasticity index, and their tensile strength is much lower than the compressive strength, so they have a wide range of applications. In recent years, the contradiction between the continuous development of the application field of brittle materials and the low processing efficiency and high processing cost of materials has become increasingly prominent. Therefore, the development of high-efficiency, low-consumption and environmentally friendly processing methods for brittle materials will effectively improve this contra...
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IPC IPC(8): B23K28/00B23K37/00
Inventor 王扬张宏志宋志星杨立军
Owner HARBIN INST OF TECH