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Mother board for touch panels

A touch panel and panel technology, applied in the input/output process of data processing, instruments, electrical digital data processing, etc., to achieve the effect of improving area utilization and reducing production costs

Inactive Publication Date: 2013-03-20
WINTEK CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the substrate is diced, these wiring areas cannot be utilized and become a burden on the production cost of the touch panel

Method used

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  • Mother board for touch panels
  • Mother board for touch panels
  • Mother board for touch panels

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] figure 1 Shown is the motherboard of the touch panel according to the first embodiment of the present invention. Please refer to figure 1 The motherboard 100 includes a substrate 110 , a plurality of first guard lines 120 , a second guard line 130 , a plurality of first sensing series 140 and a plurality of second sensing series 150 . The substrate 110 has a plurality of closely connected panel regions 112 . In this embodiment, the substrate 110 is intended to be along the edge of the panel area 112 (that is, figure 1 Dashed lines in ) were cut into multiple panels. Simultaneously fabricating multiple panels on the same substrate 110 helps to save processing steps and improve processing efficiency.

[0014] A plurality of first sensing series 140 is disposed in the panel area 112 , and the first sensing series 140 are parallel to each other. At the same time, a plurality of second sensing series 150 are arranged in the panel area 112, and the second sensing series ...

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PUM

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Abstract

The invention discloses a mother board for touch panels and a touch panel. The mother board for touch panels comprises a substrate, a plurality of first protective circuits, a second protective circuit, a plurality of first sensing tandems and a plurality of second sensing tandems, wherein the substrate is provided with a plurality of closely-connected panel areas; each first protective circuit is configured at the internal periphery of one of the panel areas; the second protective circuit is configured outside the panel areas and connected with the first protective circuits; the mutually-parallel first sensing tandems are configured in the panel areas; the mutually-parallel second sensing tandems are configured in the panel areas; and part of the first sensing tandems and part of the second sensing tandems are connected to the first protective circuits in adjacent panel areas, and the other part of the first sensing tandems and the other part of the second sensing tandems are connected to the second protective circuit outside the panel areas.

Description

technical field [0001] The present invention relates to a motherboard of a touch panel and a touch panel, and in particular to a motherboard of a touch panel and a touch panel with high space utilization efficiency. Background technique [0002] Touch Panel In order to improve the processing efficiency of the touch panel, multiple touch panels will be manufactured together on the same substrate, and after each component is completed, it will be cut into multiple touch panels. Among them, in order to prevent damage to components caused by electrostatic discharge during processing, an electrostatic discharge protection circuit is provided on the substrate. These ESD protection lines are connected to the conductive elements on the touch panel before the substrate is cut. After the substrate is cut, the ESD protection circuit must be separated from the components in the touch panel to maintain the independence of each component. Therefore, in terms of architecture design, suff...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/041
Inventor 林永常林明传林林林志强
Owner WINTEK CORP