Integrated circuit encapsulation element with spherical solder beads
A technology for packaging components and integrated circuits, which is applied to electrical components, circuits, electrical solid devices, etc., and can solve the problem of inability to transmit signals of integrated circuit packaging components, breakage of solder joints, and failure of solder joints to continue to realize electrical connection of integrated circuit packaging components, etc. problems, to achieve the effect of improving fatigue life and overall reliability, improving structural strength, and reducing size
Inactive Publication Date: 2011-10-05
QUANTA COMPUTER INC +1
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Problems solved by technology
[0004] When the integrated circuit package components of the ball grid array are subject to mechanical stress (such as installation or handling) or thermal stress (such as high temperature welding), a certain degree of warpage will occur, making some solder joints unbearable and fractured, resulting in solder joints that cannot Continue to realize the electrical connection and mechanical (physical) connection between the integrated circuit package component and the printed circuit board
In this way, the integrated circuit package components cannot communicate with the printed circuit board for signal transmission
Method used
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[0043] The following will clearly illustrate the spirit of the present invention with illustrations and detailed descriptions. After those skilled in the art understand the embodiments of the present invention, they can be changed and modified by the technology taught in the present invention, which does not depart from the present invention. spirit and scope.
[0044] figure 1 It is the distribution diagram of isostress lines when the integrated circuit package components are under stress. After the integrated circuit package component 100 is soldered on the circuit board, the equi-stress line P presented when subjected to mechanical stress or thermal stress takes a geometric center c as the center, and is concentrically distributed toward the edge of the integrated circuit package component 100, which means , the farther away from the geometric center c of the integrated circuit package component 100, the greater the stress it bears. In other words, when the integrated cir...
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The invention discloses an integrated circuit encapsulation element with spherical solder beads, which comprises a base plate and a plurality of solder beads. The solder beads are arranged on one side of the base plate. The solder beads are arranged to form a concentric array comprising a first zone and a second zone, and the second zone surrounds the first zone. The soldering area of any solder bead in the first zone of the concentric array is smaller than that of any solder bead in the second zone of the concentric array.
Description
technical field [0001] The invention relates to an integrated circuit packaging component, in particular to a welding spot arrangement form of the integrated circuit packaging component. Background technique [0002] At present, most integrated circuit package components (integrated circuit package components) are soldered on printed circuit boards (printed circuit boards), and many small solder joints (solder joints) are used to realize the connection between the integrated circuit package components and the printed circuit boards. Electrical connection versus mechanical (physical) connection. Due to the difference in elastic modulus and thermal expansion coefficient between the integrated circuit package component and the printed circuit board, the degree of bending of the two under mechanical stress or thermal stress is different. Therefore, the gap between the integrated circuit package component and the printed circuit board These solder joints may break due to this. ...
Claims
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IPC IPC(8): H01L23/488
CPCH01L2924/01006H01L2224/1413H01L24/16H01L2224/1414H01L2224/16225H01L2924/014H01L2224/13099H01L2924/01082H01L2924/351H01L2924/01033H01L24/14H01L2924/14H01L2224/14142H01L2224/14144H01L2224/14134H01L2924/00
Inventor 史洪宾吴金昌
Owner QUANTA COMPUTER INC