Insulative potting composite material with high thermal conductivity and preparation method thereof

A composite material and high thermal conductivity technology, which is applied in the field of high thermal conductivity insulating potting composite materials and their preparation, can solve the problems of inability to meet the heat dissipation requirements of high-power electronic components, and achieve the effects of easy bubble removal, no sedimentation, and convenient operation.

Active Publication Date: 2012-12-19
HEFEI BOFA NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Chinese patent CN101418123A discloses a liquid potting composition of two-component addition type silicone rubber, which has no pollution to the environment and stable performance. It does not crack at the bottom, and can play the role of moisture-proof, dust-proof, corrosion-proof, shock-proof, etc. The thermal conductivity reaches 0.4W / m·K, which cannot meet the heat dissipation requirements of high-power electronic components
Chinese patent CN101054507A discloses a high thermal conductivity silicone potting compound. The cured potting compound has good mechanical and electrical properties, high and low temperature resistance, and radiation resistance. The thermal conductivity can reach 1.1 W / m·K. Can not meet the heat dissipation requirements of high-power electronic components

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Weigh 100 parts of vinyl silicone oil and 6 parts of chloroplatinic acid catalyst in parts by mass, put them in a double planetary mixer and mix for 10 min. Slowly add filler in batches: 200 parts of 5μm spherical Al 2 o 3 , 200 parts of columnar AlN with a diameter of 0.5 μm (aspect ratio of 10), and 100 parts of acicular SiC whiskers with a diameter of 0.1 μm (aspect ratio of 50), were mixed for 60 min to prepare component A. Weigh 100 parts of vinyl silicone oil and 6 parts of hydrogen-containing silicone oil, and mix them in a double planetary mixer for 10 minutes. Slowly add the dried filler in batches: 200 parts of 5 μm spherical Al 2 o 3 , 200 parts of columnar AlN with a diameter of 0.5 μm (aspect ratio of 10), and 100 parts of acicular SiC whiskers with a diameter of 0.1 μm (aspect ratio of 50), were mixed for 60 min to prepare component B. Mix component A and component B uniformly at a mass ratio of 1:1. The resulting mixture has a viscosity of 28,000 mPa·...

Embodiment 2

[0025] Weigh 100 parts of vinyl silicone oil and 6 parts of chloroplatinic acid catalyst in parts by mass, put them in a double planetary mixer and mix for 10 min. Slowly add filler in batches: 200 parts of 5μm spherical Al 2 o 3 , 200 parts of columnar AlN with a diameter of 0.5 μm (aspect ratio of 10), and 100 parts of flaky BN with a diameter of 10 μm were mixed for 60 min to prepare component A. Weigh 100 parts of vinyl silicone oil and 6 parts of hydrogen-containing silicone oil, and mix them in a double planetary mixer for 10 minutes. Slowly add the dried filler in batches: 200 parts of 5 μm spherical Al 2 o 3 , 200 parts of columnar AlN with a diameter of 0.5 μm (aspect ratio of 10), and 100 parts of flaky BN with a diameter of 10 μm were mixed for 60 min to prepare component B. Mix component A and component B uniformly at a mass ratio of 1:1. The resulting mixture has a viscosity of 25,000 mPa·s, and is cured at 120°C for 40 minutes. The thermal conductivity of th...

Embodiment 3

[0027] Weigh 100 parts of vinyl silicone oil and 6 parts of chloroplatinic acid catalyst in parts by mass, put them in a double planetary mixer and mix for 10 min. Slowly add filler in batches: 300 parts of 5μm spherical Al 2 o 3 , 200 parts of columnar AlN with a diameter of 0.5 μm (aspect ratio of 10), 50 parts of flaky BN with a diameter of 10 μm, and 50 parts of needle-shaped SiC whiskers with a diameter of 0.1 μm (aspect ratio of 50), mixed for 60 minutes to prepare Group A point. Weigh 100 parts of vinyl silicone oil and 6 parts of hydrogen-containing silicone oil, and mix them in a double planetary mixer for 10 minutes. Slowly add the dried filler in batches: 300 parts of 5 μm spherical Al 2 o 3 , 200 parts of columnar AlN with a diameter of 0.5 μm (aspect ratio of 10), 50 parts of flaky BN with a diameter of 10 μm, and 50 parts of needle-shaped SiC whiskers with a diameter of 0.1 μm (aspect ratio of 50), mixed for 60 minutes to obtain group B point. Mix component...

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Abstract

The invention discloses an insulative potting composite material with high thermal conductivity and a preparation method thereof. The insulative potting composite material is prepared by mixing a component A with a component B at a weight ratio of 1:1 and solidifying at the temperature of 50-150 DEG C for 20-50 minutes. The insulative potting composite material has the advantages that the thermalconductivity reaches 3.5 W / m.K (ASTM D5470, HotDish method) and the electrical insulation property and mechanical properties are excellent. According to the invention, the insulative potting composite material with high thermal conductivity is prepared by using vinyl silicone oil as a base adhesive and hydrogen-containing silicone oil as a solidifying agent, using spherical, flaky, acicular and prismatical heat-conducting fillers to fill, and forming plenty of heat conducting channels by virtue of the reasonable combination of the heat-conducting fillers of different shapes; and the solidified insulative potting composite material has excellent electrical properties and mechanical properties.

Description

technical field [0001] The invention relates to a high thermal conductivity insulating potting composite material and a preparation method thereof. The composite material is mainly used for encapsulation of high-power electronic devices. Background technique [0002] With the rapid development of microelectronics integration technology, the assembly density has increased rapidly, the operating frequency of electronic components has increased sharply, and the heat generated has also increased. For every 2°C increase in the temperature of electronic components, their reliability decreases by 10% (Macromolecules, 1996, 29(10): 3376-3383). Therefore, heat dissipation becomes an important factor affecting the service life of electronic components. High thermal conductivity insulating potting composite materials can not only provide a safe and reliable heat dissipation path for electronic components, but also play the role of insulation, shock absorption, moisture resistance and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05C08K7/18C08K7/00C08K7/10C08K7/08C08K3/22C08K3/28C08K3/38C08K3/34
Inventor 徐卫兵周正发任凤梅
Owner HEFEI BOFA NEW MATERIAL TECH
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