4results about How to "Achieve composite" patented technology

This utility model discloses a fireproof wrapping tape and a cable, relating to the field of fire-resistant and heat-insulating technology. The fireproof wrapping tape includes a fireproof and heat-insulating layer and a first protective layer. The first protective layer and the fireproof and heat-insulating layer are stacked and sewn together by a seam. The seam is located in the middle of the width of the fireproof wrapping tape and extends along its length. Compared with the prior art, the fireproof wrapping tape provided by this utility model has a simple structure due to the use of a stacked first protective layer and a fireproof and heat-insulating layer, as well as a seam located in the middle of the fireproof wrapping tape and extending along its length. It allows for rapid material bonding through single-needle sewing, simplifying the bonding process, improving production efficiency, and enhancing economic benefits.

This invention proposes an in-situ conformal heating and homogenization forming method for irregularly shaped internal cavity composite cylindrical parts. The method involves: designing a composite layup of carbon fiber prepreg and a heat-replenishing adhesive film; preparing the heating and heat-replenishing adhesive film; composite laying of the carbon fiber prepreg and the heat-replenishing adhesive film; bonding the heating film with a metal outer mold; curing reaction; demolding; and machining. This invention provides an in-situ conformal heating and homogenization forming method for irregularly shaped internal cavity composite cylindrical parts. It explores the forming mechanism under the coupled action of the homogenizing temperature field and pressure field, which are synergistically controlled by the heating film and the heat-replenishing adhesive film under varying thicknesses. This forms a macroscopic multi-scale temperature gradient integrated forming technology, achieving homogenized, low-cost, high-efficiency, and low-energy-consumption manufacturing of large-size complex cylindrical parts. This meets various mechanical performance indicators of the products and enables their application, enhancing the competitiveness of high-end composite products in the defense field.

The application discloses a root system structure bionic high-temperature-resistant protective coating and a preparation method thereof. The coating comprises a root system structure module and a soil structure module. The root system structure module is a boride-silicon-based ceramic phase, and the soil structure module is a low-melting-point glass phase. The low-melting-point glass phase is stabilized by the boride-silicon-based ceramic phase in the composite coating through bionic root system structure. The preparation method comprises the following steps: mixing raw materials, densification treatment and polishing. Compared with the prior art, the application has the advantages that the low-melting-point glass in the high-temperature-resistant protective coating is effectively compounded, the softening modification effect of the glass phase is utilized, the densification temperature of the coating is reduced, the sealing degree of the oxygen-blocking structure of the coating is further promoted, the oxygen-blocking defect problem of the internal structure of the coating is solved, and the advantages of energy saving and oxygen-blocking strengthening of the coating are achieved.

The invention relates to the technical field of preparation of metal composite powder, in particular to a preparation process of tungsten-copper alloy powder, which comprises the following steps: S1, precursor compounding: performing electrochemical replacement reaction on a tungsten-containing substance and a copper-containing substance in a liquid phase to prepare a tungsten-copper composite precursor suspension; s2, freeze drying: performing spray freeze drying on the tungsten-copper composite precursor suspension to obtain fluffy porous precursor powder; and S3, reduction: performing low-temperature heat treatment on the precursor powder in a reducing atmosphere to obtain the tungsten-copper alloy powder. According to the method, copper atoms are directly subjected to reduction deposition on active sites of tungsten by utilizing the characteristic that electrochemical replacement reaction is carried out spontaneously, compounding on the atomic scale is achieved, and compared with physical mixing and surface coating of a copper plating method in the prior art, the uniformity of tungsten-copper two-phase mixing is effectively improved.