The invention discloses a low-power
LED lamp bead low-thermal-resistance packaging structure and a packaging process. The structure comprises a base, a supporting base, a heat conduction device, a light-emitting
assembly, an insulating sleeve and a protection
assembly, wherein a first mounting groove is formed in the top of the base, the supporting base is arranged on the inner wall of the first mounting groove, and the supporting base comprises a base plate; a second boss is fixedly installed at the top of the base plate, a bonding pad base is fixedly installed at the top of the second boss,a tangent plane is arranged at the top of the bonding pad base, first inserting grooves are formed in the two sides of the bonding pad base,
electrode pins are inserted into the inner walls of the first inserting grooves, and one ends of the
electrode pins are fixedly installed on the inner wall of the tangent plane. The invention has the beneficial effects that the fourth installation groove is formed in the bottom of the
copper column, a heat conduction
pipe is fixedly installed on the inner wall of the fourth installation groove, a fifth installation groove is formed in the inner wall of the heat conduction
pipe, a heat conduction column is fixedly installed on the inner wall of the fifth installation groove, first ribs are evenly installed on the outer wall of the heat conduction pipeand the outer wall of the heat conduction column, and gaps between the first ribs are filled with heat dissipation
silica gel, so the effect of releasing
heat energy is achieved.