Low-power LED lamp bead low-thermal-resistance packaging structure and packaging process

Abstract

The invention discloses a low-power LED lamp bead low-thermal-resistance packaging structure and a packaging process. The structure comprises a base, a supporting base, a heat conduction device, a light-emitting assembly, an insulating sleeve and a protection assembly, wherein a first mounting groove is formed in the top of the base, the supporting base is arranged on the inner wall of the first mounting groove, and the supporting base comprises a base plate; a second boss is fixedly installed at the top of the base plate, a bonding pad base is fixedly installed at the top of the second boss,a tangent plane is arranged at the top of the bonding pad base, first inserting grooves are formed in the two sides of the bonding pad base, electrode pins are inserted into the inner walls of the first inserting grooves, and one ends of the electrode pins are fixedly installed on the inner wall of the tangent plane. The invention has the beneficial effects that the fourth installation groove is formed in the bottom of the copper column, a heat conduction pipe is fixedly installed on the inner wall of the fourth installation groove, a fifth installation groove is formed in the inner wall of the heat conduction pipe, a heat conduction column is fixedly installed on the inner wall of the fifth installation groove, first ribs are evenly installed on the outer wall of the heat conduction pipeand the outer wall of the heat conduction column, and gaps between the first ribs are filled with heat dissipation silica gel, so the effect of releasing heat energy is achieved.

Description

technical field [0001] The invention relates to the technical field of LED lamp bead packaging, in particular to a low-power LED lamp bead packaging structure and packaging process with low thermal resistance. Background technique [0002] Due to its small size, full solid state, long life, environmental protection, power saving and other advantages, LED has been widely used in light source modules such as automotive lighting, decorative lighting, mobile phone flashlights, large and medium-sized NBs, LCD-TVs, etc. One of the most promising high-tech fields, green lighting with the advantages of energy saving, long life, maintenance-free, easy control, and environmental protection. As a new generation of green light source, high luminous efficiency is an essential feature of low-power LEDs. [0003] The existing technology has the following disadvantages: the electro-optical conversion efficiency of the existing LED is about 20% to 30%, and 70% to 80% of the energy is convert...

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Problems solved by technology

[0003] The existing technology has the following disadvantages: the electro-optical conversion efficiency of the existing LED is about 20% to 30%, and 70% to 80% of the energy is converted into heat energy that cannot be released by radiation. If the heat dissipation of the package is not good, the temperature of the chip will increase , resulting in uneven stress distribution, reduced chip luminous efficiency, and reduced phosphor conversion efficiency

[0004] At present, the COB packaging process commonly used in the industry is as follows: First, use dam glue on the surface of the substrate that has not been bonded to the bonding wire along the edge of the bonding wire area. The purpose of the dam is to prevent the fluorescent colloid from flowing out during the subsequent sealing process. , play the role of blocking glue, and finally seal the fluorescent glue. The fluorescent powder has a great influence on the attenuation of white light and is not suitable for low-power LED lamp beads. Low, more labor input, and difficult to control the yield rate

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