Insulative potting composite material with high thermal conductivity and preparation method thereof

A composite material and high thermal conductivity technology, which is applied in the field of high thermal conductivity insulating potting composite material and its preparation, can solve the problems that cannot meet the heat dissipation requirements of high-power electronic components, etc., and achieve the effect of easy bubble removal, convenient operation, and not easy to settle

Active Publication Date: 2011-10-12
HEFEI BOFA NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Chinese patent CN101418123A discloses a liquid potting composition of two-component addition type silicone rubber, which has no pollution to the environment and stable performance. It does not crack at the bottom, and can play the role of moisture-proof, dust-proof, corrosion-proof, shock-proof, etc. The thermal conductivity reaches 0.4W / m·K, which cannot meet the heat dissipation requirements of high-power electronic components
Chinese patent CN101054507A discloses a high thermal conductivity silicone potting compound. The cured potting compound has good mechanical and electrical properties, high and low temperature resistance, and radiation resistance. The thermal conductivity can reach 1.1 W / m·K. Can not meet the heat dissipation requirements of high-power electronic components

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Weigh 100 parts of vinyl silicone oil and 6 parts of chloroplatinic acid catalyst in parts by mass, and put them in a double planetary mixer to mix for 10 min. Add filler slowly in batches: 200 parts of 5μm spherical Al 2 O 3 , 200 parts of 0.5μm diameter columnar AlN (length to diameter ratio of 10), 100 parts of 0.1μm diameter of needle-like SiC whiskers (length to diameter ratio of 50), mixed for 60 minutes, to prepare A component. Weigh 100 parts of vinyl silicone oil and 6 parts of hydrogen-containing silicone oil, put them in a double planetary mixer and mix for 10 min. Slowly add the dried filler in batches: 200 parts of 5μm spherical Al 2 O 3 , 200 parts of 0.5μm diameter columnar AlN (length-to-diameter ratio of 10), 100 parts of 0.1μm diameter acicular SiC whiskers (length-to-diameter ratio of 50), mixed for 60 minutes, to obtain the B component. Mix component A and component B uniformly at a mass ratio of 1:1. The resulting mixture has a viscosity of 28000 mPa...

Embodiment 2

[0025] Weigh 100 parts of vinyl silicone oil and 6 parts of chloroplatinic acid catalyst in parts by mass, and put them in a double planetary mixer to mix for 10 min. Add filler slowly in batches: 200 parts of 5μm spherical Al 2 O 3 , 200 parts of columnar AlN with a diameter of 0.5μm (length-to-diameter ratio is 10), 100 parts of flake BN with a diameter of 10μm, mixed for 60 minutes, to obtain component A. Weigh 100 parts of vinyl silicone oil and 6 parts of hydrogen-containing silicone oil, put them in a double planetary mixer and mix for 10 min. Slowly add the dried filler in batches: 200 parts of 5μm spherical Al 2 O 3 , 200 parts of columnar AlN with a diameter of 0.5μm (length-to-diameter ratio is 10), 100 parts of sheet BN with a diameter of 10μm, mixed for 60 minutes, to obtain the B component. Mix component A and component B uniformly at a mass ratio of 1:1. The resulting mixture has a viscosity of 25000 mPa·s, and it is cured at 120°C for 40 minutes. The thermal con...

Embodiment 3

[0027] Weigh 100 parts of vinyl silicone oil and 6 parts of chloroplatinic acid catalyst in parts by mass, and put them in a double planetary mixer to mix for 10 min. Add filler slowly in batches: 300 parts of 5μm spherical Al 2 O 3 , 200 parts of columnar AlN with a diameter of 0.5μm (length-to-diameter ratio of 10), 50 parts of sheet BN with a diameter of 10μm, 50 parts of needle-like SiC whiskers with a diameter of 0.1μm (length-to-diameter ratio of 50), mixed for 60 min, to obtain group A Minute. Weigh 100 parts of vinyl silicone oil and 6 parts of hydrogen-containing silicone oil, put them in a double planetary mixer and mix for 10 min. Slowly add the dried filler in batches: 300 parts of 5μm spherical Al 2 O 3 , 200 parts of columnar AlN with a diameter of 0.5μm (length-to-diameter ratio of 10), 50 parts of sheet BN with a diameter of 10μm, 50 parts of needle-like SiC whiskers with a diameter of 0.1μm (length-to-diameter ratio of 50), mixed for 60 min, to obtain group B ...

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Abstract

The invention discloses an insulative potting composite material with high thermal conductivity and a preparation method thereof. The insulative potting composite material is prepared by mixing a component A with a component B at a weight ratio of 1:1 and solidifying at the temperature of 50-150 DEG C for 20-50 minutes. The insulative potting composite material has the advantages that the thermalconductivity reaches 3.5 W / m.K (ASTM D5470, HotDish method) and the electrical insulation property and mechanical properties are excellent. According to the invention, the insulative potting composite material with high thermal conductivity is prepared by using vinyl silicone oil as a base adhesive and hydrogen-containing silicone oil as a solidifying agent, using spherical, flaky, acicular and prismatical heat-conducting fillers to fill, and forming plenty of heat conducting channels by virtue of the reasonable combination of the heat-conducting fillers of different shapes; and the solidified insulative potting composite material has excellent electrical properties and mechanical properties.

Description

Technical field [0001] The invention relates to a high thermal conductivity insulating potting composite material and a preparation method thereof. The composite material is mainly used for packaging high-power electronic devices. Background technique [0002] With the rapid development of microelectronic integration technology, the assembly density has increased rapidly, and the operating frequency of electronic components has increased sharply, and the heat generated has also increased. The reliability of electronic components decreases by 10% for every 2°C increase in temperature (Macromolecules, 1996, 29(10): 3376-3383). Therefore, heat dissipation has become an important factor affecting the service life of electronic components. High thermal conductivity insulating potting composite materials can not only provide a safe and reliable heat dissipation path for electronic components, but also play a role in insulation, shock absorption, moisture and corrosion resistance. Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K7/18C08K7/00C08K7/10C08K7/08C08K3/22C08K3/28C08K3/38C08K3/34
Inventor 徐卫兵周正发任凤梅
Owner HEFEI BOFA NEW MATERIAL TECH
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