A low-power LED lamp bead low thermal resistance packaging structure and packaging process

Abstract

The invention discloses a low-power LED lamp bead low-thermal-resistance packaging structure and packaging technology. The technical solution is: including a base, a support seat, a heat conduction device, a light-emitting component, an insulating sleeve and a protection component, and an installation groove is opened on the top of the base. 1. The inner wall of the installation groove 1 is provided with a support seat, the support seat includes a chassis, the top of the chassis is fixedly installed with the boss 2, the top of the boss 2 is fixedly installed with a pad seat, and the top of the pad seat A cut surface is provided, a slot 1 is opened on both sides of the pad seat, an electrode pin is plugged into the inner wall of the slot 1, and one end of the electrode pin is fixedly installed on the inner wall of the cut surface. The beneficial effects of the present invention are: the copper column The bottom is provided with installation groove 4, and the inner wall of installation groove 4 is fixedly installed with a heat conduction pipe. The gap of the sheet is filled with heat dissipation silica gel, which has the effect of releasing heat energy.

Description

technical field [0001] The invention relates to the technical field of LED lamp bead packaging, in particular to a low-power LED lamp bead packaging structure and packaging process with low thermal resistance. Background technique [0002] Due to its small size, full solid state, long life, environmental protection, power saving and other advantages, LED has been widely used in light source modules such as automotive lighting, decorative lighting, mobile phone flashlights, large and medium-sized NBs, LCD-TVs, etc. One of the most promising high-tech fields, green lighting with the advantages of energy saving, long life, maintenance-free, easy control, and environmental protection. As a new generation of green light source, high luminous efficiency is an essential feature of low-power LEDs. [0003] The existing technology has the following disadvantages: the electro-optical conversion efficiency of the existing LED is about 20% to 30%, and 70% to 80% of the energy is convert...

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Problems solved by technology

[0003] The existing technology has the following disadvantages: the electro-optical conversion efficiency of the existing LED is about 20% to 30%, and 70% to 80% of the energy is converted into heat energy that cannot be released by radiation. If the heat dissipation of the package is not good, the temperature of the chip will increase , resulting in uneven stress distribution, reduced chip luminous efficiency, and reduced phosphor conversion efficiency

[0004] At present, the COB packaging process commonly used in the industry is as follows: First, use dam glue on the surface of the substrate that has not been bonded to the bonding wire along the edge of the bonding wire area. The purpose of the dam is to prevent the fluorescent colloid from flowing out during the subsequent sealing process. , play the role of blocking glue, and finally seal the fluorescent glue. The fluorescent powder has a great influence on the attenuation of white light and is not suitable for low-power LED lamp beads. Low, more labor input, and difficult to control the yield rate

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