Substrate processing device

Abstract

The invention discloses a substrate processing device, and particularly discloses a substrate processing device capable of performing scheduled working procedures of annealing, deposition, etching, and the like on a substrate. The substrate processing device comprises a cavity, a covering element and a temperature control element, wherein the cavity is used for forming a sealed processing space, the covering element is used for covering at least one part of the inner surface of the cavity, and the temperature control element is arranged between the covering element and the cavity so as to control the temperature of the processing space conveniently.

Description

technical field [0001] The present invention relates to a substrate processing device, in particular to a substrate processing device capable of implementing predetermined procedures such as annealing, deposition and etching on a substrate. Background technique [0002] A substrate processing apparatus is an apparatus capable of performing predetermined processes such as preheating, annealing, deposition, and etching on a substrate while the inner space of the processing space-chamber is at atmospheric pressure or vacuum pressure. [0003] Such substrate handling devices have become larger as glass substrates such as those used in liquid crystal display (LCD) panels have become larger. [0004] It is important for a substrate processing apparatus to maintain a processing environment with an appropriate temperature so that the substrate can be processed efficiently. In order to control the temperature of the processing space in the chamber, the walls of the chamber are forme...

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Problems solved by technology

This may increase the overall manufacturing cost, maintenance cost and repair cost, and may limit the implementation of temperature control methods

[0009] Third, it may not be easy to form a flow path in the wall of the chamber where the flow path is specially processed in the wall of the chamber

and this may increase the overall manufacturing cost of the chamber

[0010] Fourth, in the case where a heater for controlling the temperature of the processing space is installed on the outer wall surface of the chamber, the temperature control of the processing space may be affected by factors such as the chamber material, the external environment of the chamber, etc.

This may increase the overall temperature control volume

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