The invention discloses a substrate processing device, and particularly discloses a substrate processing device capable of performing scheduled working procedures of annealing, deposition, etching, and the like on a substrate. The substrate processing device comprises a cavity, a covering element and a temperature control element, wherein the cavity is used for forming a sealed processing space, the covering element is used for covering at least one part of the inner surface of the cavity, and the temperature control element is arranged between the covering element and the cavity so as to control the temperature of the processing space conveniently.