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Method for manufacturing LED package

A technology of LED packaging and manufacturing method, applied in electrical components, electric solid devices, circuits, etc., can solve the problems of shortened life of LED packaging, poor thermal conductivity of insulating layer, yellowing radiation efficiency, etc., to improve light irradiation efficiency and improve heat dissipation. Efficiency, the effect of simplifying the manufacturing process

Active Publication Date: 2013-06-19
AP TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, the thermal conductivity of the insulating layer formed on the metal substrate is poor, so even if the metal substrate is used, the problem of low thermal conductivity cannot be avoided.
[0007] Therefore, if the heat dissipation of the LED chip cannot be realized normally, the LED chip as a semiconductor component will have a yellowing phenomenon due to a change in the heat dissipation wavelength, or the light emission efficiency will be reduced, and when operating at a high temperature, the LED package The life of the LED chip may be shortened, so improving the heat dissipation structure of the LED chip is the core of the packaging structure and process

Method used

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  • Method for manufacturing LED package
  • Method for manufacturing LED package

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Embodiment Construction

[0027] The above-mentioned object, technical configuration, functional effect, etc. of the manufacturing method of the LED package according to the present invention will be more clearly understood by referring to the following detailed description with reference to the accompanying drawings showing preferred embodiments of the present invention.

[0028] figure 1 is a cross-sectional view showing an LED package according to the present invention, figure 2 is a plan view showing the LED package according to the present invention.

[0029] As shown in the figure, the LED package 100 according to the present invention may include: a metal substrate 110, which has an anode terminal 111 and a cathode terminal 112; an LED chip 120, which is mounted on the metal substrate 110; a plastic package 130, which is packaged on the metal substrate 110 ; and the lens part 140 , which is integrally formed with the plastic sealing part 130 .

[0030] The metal substrate 110 may be composed ...

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Abstract

The present invention relates to a method for manufacturing an LED package. A method for manufacturing an LED package of the present invention comprises the steps of: preparing a metal member which is cut in a strip form; forming, on said metal member, a metal substrate in which an anode terminal and a cathode terminal are formed at predetermined intervals; mounting an LED chip on a chip-mounting portion of said metal substrate; wire-bonding said LED chip with the anode terminal and the cathode terminal; and integrally forming a molding unit and a lens unit at the upper part of said metal substrate.

Description

technical field [0001] The invention relates to a method for manufacturing an LED package, more particularly to a method for manufacturing an LED package that directly mounts an LED chip on a metal substrate to improve heat dissipation efficiency. Background technique [0002] Generally, a light emitting diode (LED: light emitting diode, hereinafter referred to as LED) is a diode that flows current in a semiconductor pn junction to emit light. Gallium arsenide (GaAs) is a light emitting diode used for infrared rays, gallium aluminum arsenide (GaAIAs) ) is used as an infrared or red light-emitting diode, gallium arsenide phosphide (GaAsP) is used as a red, orange or yellow light-emitting diode, gallium phosphide (GaP) is used as a red, green or yellow light-emitting diode, nitrogen Gallium nitride (GaN) is a white light-emitting diode that emits white light by mixing rare-earth materials chromium, thulium, and terbium with phosphors used as active ions. [0003] In addition,...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/62
CPCH01L24/97H01L25/0753H01L33/54H01L33/62H01L2224/48091H01L2924/12041H01L2924/181H01L2924/1815H01L2933/005H01L2924/00014H01L2924/00H01L33/48H01L33/58
Inventor 朱宰哲金荣锡
Owner AP TECH CO LTD
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