Method for manufacturing LED package
A technology of LED packaging and manufacturing method, applied in electrical components, electric solid devices, circuits, etc., can solve the problems of shortened life of LED packaging, poor thermal conductivity of insulating layer, yellowing radiation efficiency, etc., to improve light irradiation efficiency and improve heat dissipation. Efficiency, the effect of simplifying the manufacturing process
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[0027] Matters such as the technical constitution and operational effects of the above-mentioned object of the manufacturing method of the LED package according to the present invention will be more clearly understood by referring to the following detailed description of the accompanying drawings showing preferred embodiments of the present invention.
[0028] figure 1 Is a cross-sectional view showing the LED package according to the present invention, figure 2 It is a plan view showing the LED package according to the present invention.
[0029] As shown in the figure, the LED package 100 according to the present invention may include: a metal substrate 110, which has an anode terminal 111 and a cathode terminal 112; an LED chip 120, which is mounted on the metal substrate 110; and a plastic part 130, which is packaged on the metal substrate 110 on; and the lens part 140, which is integrally formed with the plastic part 130.
[0030] The above-mentioned metal substrate 110 may be ...
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