Method and device for optimizing technological process

Abstract

The invention discloses a method for optimizing a technological process. An optimized technological process is produced in advance, and the number of batches of wafer sets and a starting position and an ending position of a technological process to be optimized are preset. The method comprises the following steps: the wafer sets are carried out according to a normal technological process, when the wafer sets are carried out to the starting position of the technological process to be optimized, the wafer sets are separated into a plurality of batches according to a preset valve, wherein M batches of wafer sets are continuously carried out according to the normal technological process, N batches of wafer sets are carried out according to the optimized technological process, and M and N are positive integers more than or equal to 1; when the M batches of wafer sets are carried out to the ending position of the technological process to be optimized according to the normal technological process, and the N batches of wafer sets are finished carrying out the optimized technological process, the N batches of wafer sets and the M batches of wafer sets are combined and wait for after-treatment. Meanwhile, the invention further discloses a device for optimizing the technological process; and with the adoption of the method and the device, the cost for optimizing can be lowered.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a process flow optimization method and device. Background technique [0002] In the production and manufacture of integrated circuits, each wafer needs to go through hundreds or even thousands of processes from raw materials to final products, and all the processes that the wafer goes through constitute the process flow. Under normal circumstances, the wafer executes each process step by step according to the preset process flow, that is to say, the content of each process in the process flow is preset, and the content of each process also includes the specific process. The parameters also pre-set the time sequence for the execution of each process, and the process flow drive engine controls the chip to execute each process in sequence according to the pre-set process flow. [0003] However, in many cases, the wafer needs to be processed according to the optimized...

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Problems solved by technology

[0009] It can be seen that in the optimization method of the process flow provided by the prior art, the operator manually batches the wafers according to the paper of the operation steps of each process in the optimized process flow, and manually follows the steps of each process in the optimized process flow. The specific process parameters of the process set the process parameters of each batch of wafers respectively. It can be seen that the optimization of the process flow in the prior art must rely on the manual operation of the operator. If the operator makes a wrong operation, the wafer may be scrapped, thereby increasing optimized cost

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