Stamping-laminating apparatus and method

一种设备、冲压工件的技术，应用在冲压-层叠设备领域，能够解决芯片耗费时间、生产率降低等问题

Active Publication Date: 2011-11-16
TOYOTA BOSHOKU KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it takes a certain amount of time to discharge stacked chips
Therefore, if the processing of the chip is suspended during the ejection of other chips, the production rate will be significantly reduced

Method used

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  • Stamping-laminating apparatus and method
  • Stamping-laminating apparatus and method
  • Stamping-laminating apparatus and method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0028] will now refer to Figure 4 to Figure 9B A first embodiment of the present invention will be described.

[0029] Such as Figure 4 to Figure 6 As shown in , the press-lamination apparatus includes a workpiece support portion 11 for supporting a workpiece W. The workpiece W is held by the workpiece support portion 11 in one direction ( Figure 4 in the direction of the arrow) to send. Above the workpiece support portion 11, an elevating member 12 serving as an elevating member is provided. The holding member 13 is supported by a spring 14 on the lower surface of the lifting member 12 . The holding member 13 is movable relative to the lifting member 12 in a direction in which the lifting member 12 ascends and descends. The spring 14 applies a downward force to the holding member 13 . When the lifting member 12 descends, the workpiece W is firmly held between the holding member 13 and the workpiece support portion 11 in a state where the workpiece W is placed on the ...

no. 2 approach

[0052] will now refer to Figure 10A and Figure 12DA press-lamination apparatus according to a second embodiment of the present invention is described. In the description of the second embodiment and subsequent embodiments, differences from the first embodiment will be mainly explained.

[0053] The second embodiment is to prevent loss of material and waste of time from occurring when punches 20 are switched after punching a predetermined number (100) of chips has been completed. Such as Figure 9A As shown in , in the first embodiment, after finishing punching a predetermined number of chips in the upstream punching structure 15A, the workpiece W must move through three pitches without punching before the downstream punching structure 15B starts punching again. . Such as Figure 9B As shown in , even if stamping structure 15A starts stamping immediately after stamping structure 15B finishes stamping a predetermined number of chips, there will still be an unprocessed por...

no. 3 approach

[0060] will now refer to Figure 13A to Figure 13D A third embodiment of the present invention will be described.

[0061] In the third embodiment, the selection switching cam 38A of the selection mechanism 37A and the selection switching cam 38B of the selection mechanism 37B are arranged in a direction perpendicular to the direction in which the workpiece W is conveyed, and the selection switching cam 38A, selection switching cam 38A, selection switching cam 38B of the selection mechanism 37A The selection switching cams 38B of the mechanism 37B are connected to each other by a coupling portion 45 . On the lower surface of the selection switching cam 38A corresponding to the upstream punching structure 15A, a convex cam surface 38a, a concave cam surface 38b, a convex cam surface 38a, and a concave cam surface are formed sequentially from the lower side shown in FIG. Surface 38b. On the lower surface of the selection switching cam 38B corresponding to the downstream punchi...

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PUM

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Abstract

Punching structures (15A, 15b) each include a die (19), a punch (20) that cooperates with the die (19) to stamp a workpiece W, a die supporting member (21) that applies lateral pressure to core pieces Wa stamped out from the workpiece W, and a counter pressure applying mechanism (23) that applies counter pressure toward the punch to the core pieces Wa from the side opposite to the punch (20). Thepunching structures (15A, 15b)also include selecting mechanisms (37A, 37B), respectively. The punching structures (15A, 15b) laminate core pieces Wa while applying lateral pressure and counter pressure to the core pieces Wa. The punching structures (15A, 15b) are arranged along the conveyance direction of the workpiece W. The selecting mechanisms (37A, 37B) select one of the punching structures to be put in a pause state, so that one of the punching structures (15A, 15b) is put in a pause state during a stamping operation of the punching structures (15A, 15b).

Description

technical field [0001] The present invention relates to a punching-stacking apparatus and method suitable for manufacturing motor cores to continuously punch out chips such as ring-shaped materials from a workpiece and stack a predetermined number of chips for each unit. Background technique [0002] Japanese Patent Application Laid-Open No. 2006-26735 discloses such a press-lamination apparatus. The punch-and-laminate apparatus includes a die and a punch. The punch faces the upper surface of the die and is arranged to be movable along the same axis as the die. A transverse pressure ring is arranged below the die head. The transverse pressure ring may also be arranged on the same axis as the die and at a location adjacent to the die. As the punch is lowered toward the die, chips are punched from the workpiece. The lateral pressure ring applies lateral pressure to the plurality of chips. A predetermined number of chips may be stacked inside the lateral pressure ring. Ac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02K15/02
CPCH02K2201/09H02K15/02Y10T156/13Y10T156/1304
Inventor 平田和之
Owner TOYOTA BOSHOKU KK
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