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Ultrasonic probe and manufacturing method of ultrasonic probe

A manufacturing method, ultrasonic technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, fluids using vibration, applications, etc., can solve the problems of poor wiring space efficiency, etc., and achieve the effect of easy handling and low cost

Inactive Publication Date: 2011-11-30
KK TOSHIBA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the efficiency of the wiring space of the multilayer FPC is poor

Method used

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  • Ultrasonic probe and manufacturing method of ultrasonic probe
  • Ultrasonic probe and manufacturing method of ultrasonic probe
  • Ultrasonic probe and manufacturing method of ultrasonic probe

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0041] figure 1 It is a view of the ultrasonic probe 1 according to the first embodiment viewed from the ultrasonic radiation surface side. exist figure 1 In , the direction in which ultrasonic waves are emitted (direction perpendicular to the paper surface) is defined as the Z axis. The direction perpendicular to the Z axis and extending the FPC from the front surface of the back material not shown is defined as the Y axis. Furthermore, let the direction perpendicular to the Z-axis and the Y-axis be the X-axis.

[0042] while referring to figure 2 The configuration of the ultrasonic probe 1 according to the first embodiment will be described.

[0043] figure 2 for along figure 1 a-a' is a diagram showing an example of the cross section of the ultrasonic probe 1 viewed from the X direction. Such as figure 2 As shown, the ultrasonic probe 1 has: a piezoelectric layer 5, a first acoustic matching layer 7, a second acoustic matching layer 9, a common electrode (firs...

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PUM

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Abstract

According to one embodiment, an ultrasonic probe includes a plurality of piezoelectric elements, a first electrode, a plurality of second electrodes, a plurality of stacked flexible printed circuit boards, and a plurality of connection portions. The plurality of piezoelectric elements are arrayed. The first electrode is provided on the emitting surface side of the plurality of piezoelectric elements. The plurality of second electrodes are respectively provided on the rear surface sides of the plurality of piezoelectric elements. The plurality of stacked flexible printed circuit boards respectively include a plurality of terminals. The plurality of connection portions electrically connect the second electrodes to the terminals. At least one of the flexible printed circuit boards extends longer than the flexible printed circuit board serving as an upper layer.

Description

[0001] Cross References to Related Applications [0002] This application is based on and claims priority from prior Japanese Patent Application No. 2010-120885 filed on May 26, 2010, the entire contents of which are hereby incorporated by reference. technical field [0003] Embodiments described herein generally relate to ultrasound probes and methods of manufacturing ultrasound probes. Background technique [0004] An ultrasonic probe includes a two-dimensional array probe array probe in which transducers are arranged in a two-dimensional lattice. Since the number of transducers in the two-dimensional array probe is larger than that in the one-dimensional array probe, an IC (Integrated Circuit) related to a part of ultrasonic transmission and reception may be incorporated in the two-dimensional array probe. In this case, a flexible printed circuit board (Flexible Printed Circuit board: hereinafter referred to as “FPC”) may be arranged on the back surface of the vibrator. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B06B1/06H10N30/00H10N30/05
CPCH01L41/27B06B1/064Y10T29/49005Y10T29/42H04R17/00A61B7/00H05K1/00H10N30/05
Inventor 四方浩之手塚智尾名康裕久保田隆司牧田裕久
Owner KK TOSHIBA