Process for manufacturing smooth surface roughened electrolytic copper foil

Abstract

The invention relates to a process for manufacturing smooth surface roughened electrolytic copper foil, which comprises a step of pickling, a step of primary smooth surface roughening, a step of secondary smooth surface roughening, a step of primary smooth surface curing, a step of secondary smooth surface curing, a step of double-size anti-oxidization treatment, a step of double side passivation and a step of smooth surface coupling agent treatment, which are accomplished continuously on the same production line. Compared with the prior art, the smooth surface roughened electric copper foil manufactured by the process for manufacturing the smooth surface roughened electrolytic copper foil has the advantages of short copper teeth, easy etching, and high impedance controllability. When the copper foil is used in production of downstream products, the needs of blackening micro corrosion and toughening treatment are obviated, so the manufacturing process is shortened, and the short circuit rate and open circuit rate are lowered; meanwhile, the copper foil manufactured by the process has the same quality as the conventional high-precision or double-side toughened electrolytic copper foil, is produced at low cost and is more suitable for manufacturing the inner layers of high-precision multilayer plates and high-density fine line printed circuit boards (PCBs).

Description

technical field [0001] The invention relates to a manufacturing method of copper foil, in particular to a manufacturing process of smooth surface roughened electrolytic copper foil. Background technique [0002] With the development of electronic information technology, multi-layer complex or high-density thin circuit PCB boards are increasingly used in high-precision miniaturized electronic products. Traditional methods usually use high-precision electronic copper foil or double-sided roughened electrolytic copper foil for high-precision electronic products. Density and fine line PCB boards or multi-layer complex PCB board inner layers, using traditional high-precision electrolytic copper foil requires complex processes such as micro-etching and blackening after pressing the board, the production process is long and costly; using double-sided roughened electrolytic copper foil is It increases the complexity of the copper foil itself and increases the processing cost; second...

AI Technical Summary

Problems solved by technology

[0002] With the development of electronic information technology, multi-layer complex or high-density thin circuit PCB boards are increasingly used in high-precision miniaturized electronic products. Traditional methods usually use high-precision electronic copper foil or double-sided roughened electrolytic copper foil for high-precision electronic products. Density and thin circuit PCB board or multi-layer complex PCB board inner layer, using traditional high-precision electrolytic copper foil requires complex processes such as micro-etching and blackening after pressing the board, the production process is long and the cost is high; using double-sided roughened electrolytic copper foil It increases the complexity of the copper foil itself and increases the processing cost; secondly, these two kinds of copper foils have the defect of long copper teeth when used in the inner layer of multi-layer boards or high-density thin circuit PCB boards, which is very easy to cause problems for subsequent The product brings major hidden dangers of short circuit and open circuit

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