A kind of preparation method of plastic product and a kind of plastic product
A technology of plastic products and plastics, which is applied in the direction of superimposed layer plating, metal material coating process, liquid chemical plating, etc. Advanced problems, to achieve the effect of low cost, low energy requirement and simple process
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[0015] The invention provides a kind of preparation method of plastic product, comprises the following steps:
[0016] 1) molding plastic substrate; the plastic substrate is a thermoplastic or thermosetting plastic containing an electroless plating accelerator, and the electroless plating accelerator is evenly distributed in the thermoplastic or thermosetting plastic; the electroless plating accelerator has the general formula ABO 3 A perovskite structure compound, wherein A contains at least one of the elements in the 9th, 10th, and 11th columns of the periodic table, and A selectively contains one or more of the IA, IIA group elements, and lanthanide elements; B One or more of the group IVB and VB elements;
[0017] 2) Laser vaporizes the surface of the plastic substrate, exposing the electroless plating accelerator;
[0018] 3) Electroless copper plating or electroless nickel plating on the surface of the electroless plating promoter in step 2), continue to perform at leas...
Embodiment 1
[0050] (1) CaCu 3 Ti 4 o 12 Put it into a high-speed ball mill and mill it for 10 hours until the average particle size of the powder is 700nm; mix PPE / PPS resin alloy, CaCu 3 Ti 4 o 12 , calcium silicate fiber and antioxidant 1010, according to the mass ratio of 100:10:30:0.2, mixed with a high mixer, extruded and pelletized with a twin-screw extruder (Nanjing Rubber and Plastic Machinery Factory), and injection molded into LED Lamp circuit board carrier.
[0051] (2) Use an infrared laser (Tide, DPF-M12) to print the metal circuit pattern on the LED lamp circuit board carrier. The laser parameters are: wavelength 1064nm, scanning speed 1000mm / s, step size 9μm, delay 30μs, frequency 40KHz , power 3W, filling pitch 50 μm; after the laser irradiation is completed, the surface of the plastic carrier is ultrasonically cleaned.
[0052] (3) Immerse in the chemical nickel plating solution for 10 minutes to form a nickel layer with a thickness of 3 μm; immerse in the chemical ...
Embodiment 2
[0055] Adopt the method identical with embodiment 1 to prepare the plastic product of the present embodiment, difference is:
[0056] In step (1), the CuNiTi 2 o 6 Ball milled to an average particle size of 800nm and dried; PEEK resin, CuNiTi 2 o 6 , glass fiber and antioxidant 168 are mixed according to the mass ratio of 100:20:30:0.2, extruded and granulated, and then injection molded to form an automobile engine electronic connector housing;
[0057] In step (3), the order of electroless plating is: first electroless nickel plating forms 2 μm thick nickel layer in 8 minutes, then electroless copper plating forms 13 μm thick copper layer in 3 hours, then electroless nickel plating forms 3 μm thick nickel layer in 10 minutes, Finally, a gold layer with a thickness of 0.03 μm is flash-plated.
[0058] Through the above steps, the plastic product used as the housing of the electronic connector of the automobile engine in this embodiment is obtained.
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Abstract
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