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White coating composition, method for selective metallization of insulating substrate surface and composite product

A technology for insulating substrates and compositions, which is applied in metal material coating process, coating, thin material processing, etc., can solve the problem of inability to prepare white products, and achieve the effect of selective metallization and good adhesion

Active Publication Date: 2017-02-22
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the technical problem that the white product cannot be prepared in the above method, the present invention provides a white coating composition, a method for selectively metallizing the surface of an insulating substrate using the white coating composition, and a composite product obtained by the method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] (1) 200 parts by mass of SnO with an average particle size of 50nm 2 and 2.9 parts by mass of dispersant DISPERBYK-110 were added to 100 parts by mass of solvent ethanol, and ball milled for 8 hours with a planetary ball mill; then 10 parts by mass of binder HR-7004, 2.3 parts by mass of defoamer BYK-053, and 3.27 parts by mass of fluid were added Leveling agent BYK-306, 2.95 parts by mass of viscosity modifier fumed silica, and ball milling for 9 hours to obtain a uniform and stable white paint composition S10;

[0054] (2) Spraying the white paint composition S10 onto the surface of the LED lamp circuit board carrier to obtain a white LED lamp circuit board carrier (the thickness of the white coating on the surface is 17.6 μm);

[0055] (3) Use an infrared laser (Tide, DPF-M12) to irradiate the selected area of ​​the white LED lamp circuit board carrier, and print a metal circuit pattern on its surface. The laser irradiation conditions include: wavelength 1064nm, scan...

Embodiment 2

[0059] Adopt the method identical with embodiment 1 to prepare the composite product of the present embodiment, difference is:

[0060] In step (1), 275 parts by mass of ZnTiO with an average particle size of 20nm 3 and 3.4 parts by mass of dispersant DISPERBYK-2150 were added to 100 parts by mass of solvent methyl ethyl ketone, and ball milled for 12 hours using a planetary ball mill; then 13 parts by mass of binder Desmolux® XP 2513, 2.65 parts by mass of defoamer BYK-018, 3.44 parts by mass of Leveling agent BYK-356, 2.3 parts by mass of viscosity regulator polyamide wax, and continue ball milling for 12 hours to obtain a uniform and stable white paint composition S20;

[0061] In step (2), the white coating composition S20 is printed on the surface of the electronic connector housing of the automobile engine by gravure printing to obtain a white housing of the electronic connector of the automobile engine (the thickness of the white coating on the surface is 29.4 μm);

[...

Embodiment 3

[0066] Adopt the method identical with embodiment 1 to prepare the composite product of the present embodiment, difference is:

[0067] In step (1), 110 parts by mass of ZnSnO with an average particle size of 90 nm 3 Add 0.7 parts by mass of dispersant DISPERBYK-140 to 100 parts by mass of solvent water, and use a planetary ball mill for 7 hours; then add 6 parts by mass of binder Bayhydrol® XP2557, 0.45 parts by mass of defoamer BYK-051, and 0.16 parts by mass of leveling Agent BYK-333, 1.64 parts by mass of viscosity modifier polyvinyl alcohol, and continue ball milling for 8 hours to obtain a uniform and stable white paint composition S30;

[0068] In step (2), the white coating composition S30 is applied to the surface of the ceramic integrated circuit base using transfer printing technology, and the thickness of the formed white coating is 87 μm;

[0069] In step (3), a green laser (Han’s, EP-25-THG-D) is used to irradiate the selected area of ​​the ceramic integrated ci...

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PUM

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Abstract

The invention provides a kind of white paint composition, contains chemical plating catalyst precursor, binding agent, solvent in the described white paint composition, contains or does not contain additive; Described chemical plating catalyst precursor is selected from SnO2, ZnSnO3 , ZnTiO3 at least one. The invention also provides a method for selectively metallizing the surface of an insulating substrate by using the white paint composition and a composite product obtained by the method. The white coating composition provided by the invention can meet the requirements of white products; at the same time, the white coating composition is used to form a white coating on the surface of the insulating substrate without any influence on the various properties of the insulating substrate itself. After that, direct electroless plating on the coating surface can be realized, so as to realize selective metallization and obtain composite products with good adhesion.

Description

technical field [0001] The invention belongs to the field of surface metallization of non-metallic materials, and in particular relates to a white paint composition, a method for selectively metallizing the surface of an insulating substrate by using the white paint composition, and a composite product obtained by the method. Background technique [0002] A metal layer is formed on the surface of the plastic as a channel for electromagnetic signal transmission. It has been widely used in automobiles, industries, computers, communications and other fields. The selective formation of a metal layer on the plastic surface is a core link in the manufacture of such plastic products. There are many methods for plastic surface metallization production lines. In the prior art, metal nuclei are generally formed on the surface of the plastic substrate as the catalytic active center of electroless plating, and then electroless plating is performed. [0003] For example, the applicant's...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/18C23C18/31C23C18/16C23C18/54
CPCC09D1/00C23C18/1608C23C18/1612C23C18/1651C23C18/1653C23C18/1868C23C18/1882C23C18/204C23C18/2066Y10T428/24917H05K1/0373H05K3/185H05K3/188
Inventor 宫清周维林信平苗伟峰陈小芳
Owner BYD CO LTD
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