70results about How to "Low energy requirements" patented technology

The invention provides a plastic product and a preparation method thereof. The method comprises the following steps: 1) forming a plastic base, wherein the plastic base contains chemically plated catalysts which are compounds shown in the formula I, II or III; 2) removing the plastics in the selected area on the surface of the plastic base and exposing the chemically plated catalysts in the corresponding area; and 3) chemically plating copper or nickel and continuing chemical plating and/or electroplating at least once to form a metal layer on the surface of the plastic base. The preparation method provided by the invention has the advantages of simple process, low requirement for energy and low cost. In addition, the chemically plated catalysts are distributed in the plastic base, so the plating layer formed after chemical plating and the plastic base have very high adhesion.

The invention discloses a wireless sensor network and constructing method and communication method capable of self-adapting the web knot according to network structure variation, and variation of service data transferring demand and variation of network management command. The wireless sensor network is isomorphism grouping network structure of node cluster management. Make the knobs which can directly communicate into a cluster, constructing a topological structure of cluster network linking. The communication dispatching of the network nodes can be divided into intra-cluster nodes communication dispatching and inter-cluster nodes communication dispatching. According to the network structure design, set the intra-cluster network nodes constructing cluster network work periods. A cluster network working period comprises cluster resting period, inter-cluster interchanging nodes communicating work period and intra-cluster nodes communication work period. The network nodes is used for self-adapting each working period and the communication time of cluster nodes of each working period, and communication time width to reach the network optimization.

The invention discloses a preparation method of a plastic product, and the plastic product made with the method. The method comprises the following steps: (1) forming a plastic substrate comprising a chemical plating promoter, wherein the chemical plating promoter is a substance which can promote a chemical reduction reaction in a chemical plating liquid; (2) carrying out a sand-blasting treatment upon a selected area on the surface of the plastic substrate, such that the chemical plating promoter are revealed in the area, and an active area which can be chemically reduced is formed; (3) chemically plating copper or nickel on the active area obtained from step (2), and carrying out at least one time of chemical plating and/or electroplating, such that a metal coat is formed on the plastic substrate. The method provided by the present invention has advantages of simple technology, low energy requirement, and low cost. Further, because the chemical plating promoter is distributed in the substrate, the bonding force between the chemically plated coat and the plastic substrate is strong.

The invention provides a plastic product and a preparation method thereof. The method comprises the following steps of: (1) molding a plastic substrate, wherein the plastic substrate contains a chemical plating accelerating agent which is a compound shown as the formula I or II; (2) irradiating a selected region on the surface of the plastic substrate by laser, and exposing the chemical plating accelerating agent on a corresponding region; and (3) chemically plating copper or nickel, continuing to carry out chemical plating and/or electroplating at least once, and forming a metal layer on the surface of the plastic substrate. The preparation method provided by the invention has the advantages of simple process, low energy requirements and low cost; in addition, the chemical plating accelerating agent is distributed in the plastic substrate, therefore, a plating layer formed after the chemical plating has very high binding force with the plastic substrate.

A silica gel absorbent with nano pores is prepared through immersing inorganic fibrous paper in water glass for 10-24 hr, drying for 10-24 hr, immersing in aquous solution of precipitant for 12-24 hr, drying in air, immersing in acid for 12-24 hr, water washing until it become neutral, drying in air, and program heating. It can be used as demoistening core of air conditioner. Its advantages are high adsorptive power, and low energy consumption and regenerating temp.

The material for preparing titanium silicate adsorbent has molar ratio between Si and Ti of 8-20,and the proportion among alkoxide, water and polyethylene glycol of 1 to 5-15 to 0.002-0.005. The preparation includes the steps of sol preparation and titanium silicate preparation. The sol preparation includes partial hydrolysis of ethanol solution of silanolate, adding ethanol solution of titanic alkoxide while heating for complete hydrolysis; and adding polyethylene glycol for condensation to form sol. In the titanium silicate preparation, the sol is prepared into hydrogel through oil-free formation process and the hydrogel is then prepared into nano spherical titanium silicate via washing, drying and sieving. The titanium silicate product has high adsorption performance and is used in producing core of dehumidifying wheel.

The invention discloses a preparation method of a plastic product. The preparation method comprises the following steps: 1) shaping a plastic substrate, wherein the plastic substrate contains a chemical plating accelerator, and the chemical plating accelerator is one or more of Ni2O3, Co2O3, CuSiO3, CuC2O4, Cu/Fe/Mn or Cu/Fe/Al ternary co-sintering oxide and Cu/Fe/Al/Mn quaternary co-sintering oxide; 2) gasifying the surface of the plastic substrate by use of laser, and exposing the chemical plating accelerator; and 3) chemically plating copper or chemically plating nickel, and further carrying out chemical plating and/or electroplating at least once, so as to form a metal layer on the surface of the plastic substrate. The preparation method provided by the invention has the advantages ofsimple process, low energy requirement and low cost; and in addition, the chemical plating accelerator is distributed in the plastic substrate, thus the bonding force of a plating layer formed by chemical plating and the plastic substrate is extremely high. The invention further discloses a plastic product prepared by the method.

The invention provides a method for producing a plastic product and the plastic product. The production method comprises the following steps: 1) forming a plastic substrate, wherein the plastic substrate comprises a chemical plating enhancer which is one or more selected from Ni2O3, Co2O3, CuSiO3, CuC2O4, Cu/Fe/Mn or Cu/Fe/Al ternary co-sintering oxide, Cu/Fe/Al/Mn quaternary co-sintering oxide; 2) laser gasificating the surface of the plastic substrate, exposing the chemical plating enhancer; 3) performing chemical copper plating or chemical nickel plating, continuously carrying out a chemical plating and/or electroplating, forming a metal layer on the surface of the plastic substrate. The method of the invention has the advantages of simple process, low energy requirement and low cost; in addition, the chemical plating enhancer is distributed in the plastic substrate, thereby a plating layer formed by chemical plating has high binding force with the plastic substrate.

A pin puller based on a memory alloy wire comprises a pin, a housing, a pull rod, an ejection spring, a front insulating mat, a pull tray, a memory alloy wire, a PCB (printed circuit board), a rear cover and a service conductor, wherein two bonding pads of the PCB are conducted respectively, but not with each other; the pull rod is sleeved and fixedly connected with the front insulating mat and the pull tray; the two ends of the memory alloy wire are soldered and fixed with the PCB; the service conductor is welded on the service conductor bonding pad of the PCB and thrown out through an opening in the housing; the pull rod penetrates out of a waist-shaped hole in the housing; the pull rod is sleeved with the ejection spring; and the pin is inserted into the ejection spring and screwed into the pull rod. according to the pin puller, the problem of too small operation force of the memory alloy wire is solved by adopting the method of back-and-forth shuttling of the memory alloy wire between the pull tray and the PCB for many times; compared with the existing pin puller for an initiating explosive device, the pin puller has the advantages of low energy source requirements, large output pull and easiness in reliability and safety guarantee.

The invention relates to a brass fitting laser welding method. The brass fitting laser welding method comprises the following steps that 1, to-be-welded surfaces of two brass fittings are cleaned; 2,the two brass fittings are positioning; 3, laser backing welding is carried out, the diameter of a light spot at a focal point is 0.2-0.5 mm, the laser power is 600-1500 W, the welding speed is 6-15 mm/s, the defocusing amount is -3 mm to +3 mm, and a gas shielded welding mode is adopted; and 4, laser cover surface welding is carried out, the diameter of the light spot at the focal point is 0.2-0.5 mm, the laser power is 600-1500 W, the welding speed is 6-15 mm/s, the defocusing amount is +4 mm to +15 mm, and the gas shielded welding mode is adopted. According to the brass fitting laser welding method, the laser backing welding and the laser cover surface welding are combined together to achieve the laser welding of the brass fittings, through reasonable selection of technological parameters of two welding procedures, a weld joint with the good performance and the attractive appearance can be obtained, the complex procedures in the brass fitting welding manufacturing process can be simplified, and the production efficiency of brass tube welding can be remarkably improved.

The invention relates to the technical field of plate turnover during the processing of composite plates and especially relates to a plate turnover. The plate turnover comprises an upper framework, a lower framework, a chain, a connecting rod, a plate clamping frame, a pulley platform, a motor, an infrared sensor and a PLC control system. The invention solves the problems that the cost of production line is high since present plate turnover machines are heavy and occupy large space and it is troublesome to adjust and mount plate overturn machines when a production line requires adjustment.

The invention discloses a preparation method of butenafine hydrochloride liniment. Firstly butenafine hydrochloride hydroxypropyl-beta-cyclodextrin clathrate compound is prepared and then the clathrate compound is dissolved to prepare a liniment. In the process of preparing the clathrate compound, the weight ratio of the butenafine hydrochloride and the hydroxypropyl-beta-cyclodextrin, the constant temperature blending time, the blending speed and the temperature are optimally selected. The inclusion of the butenafine hydrochloride by the hydroxypropyl-beta-cyclodextrin enhances the solubility of the butenafine hydrochloride, thereby solving the problem of poor water solubility of the butenafine hydrochloride. Meanwhile, the preparation method significantly reduces the consumption of ethanol, thus reducing the irritation of the liniment to the skin of the user.

The invention provides a chip processing method and relates to the technical field of semiconductor device processing. The provided chip processing method can reduce the thickness of a chip to the thickness meeting ground single-particle effect test after steps of leveling, primary thinning and secondary thinning and the like of the chip on a printed-circuit board; and through such physical thinning, the case of chip deformation caused by chip re-welding in the operation process of thinning first and welding later can be avoided, and meanwhile, the case of over-corrosion or under-corrosion easily occurring in chemical thinning process is avoided. Even if the low-energy heavy ions, which are low in energy, are used, the single-particle effect test can also be carried out on the thinned chip, thereby reducing energy requirements for a heavy-ion accelerator in the single-particle effect test.

Provided are multilayer laminates having one or more layers comprising twisted nematic liquid crystals and one or more layers of a polymeric sheet comprising a polymer with a modulus between 20,000 psi (138 MPa) and 100,000 psi (690 MPa). The twisted nematic liquid crystal layers reflect infrared radiation. Thus, the multilayer laminates are useful to reduce the transmission of infrared energy. For example, in some embodiments the multilayer laminates are useful as windows to reduce energy consumption necessary to cool the interior of a structure such as an automobile or building. Preferably, the multilayer laminates retain the beneficial properties of safety glass. The multilayer laminates may include additional layers such as infrared absorbing layers, half wave plates, and the like, to minimize the transmission of infrared energy. The multilayer laminates may also include further additional layers such as polymeric films, polymeric sheets, rigid sheets, and the like.