Plastic product and preparation method thereof
A technology for plastic products and plastics, applied in chemical instruments and methods, layered products, thin material processing, etc., can solve problems such as high energy requirements, poor adhesion between coatings and plastic substrates, and complex metallization processes on plastic surfaces.
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[0016] The invention provides a kind of preparation method of plastic product, comprises the following steps:
[0017] 1) molding plastic matrix; said plastic matrix is thermoplastic or thermosetting plastic containing electroless plating accelerator, and electroless plating accelerator is evenly distributed in thermoplastic or thermosetting plastic; Described electroless plating accelerator is the compound shown in formula I or II ;
[0018] AM x B y o z ……………………………………………Formula I
[0019] Among them, x=0-2, y=0.01-2, z=1-4; A is a metal element in the 10th and 11th columns of the periodic table; M is a trivalent metal element selected from Fe, Co, Mn, Al , Ga, In, Tl, one of the rare earth elements;
[0020] A'M' m o n ………………………………………………Formula II
[0021] Among them, m=0.01-2, n=2-4; A' is a metal element in the 9th, 10th and 11th columns of the periodic table, and M' is selected from one of Cr, Mo, W, Se, Te, Po;
[0022] 2) The laser is irradiated on a selected...
Embodiment 1
[0060] (1) CuFe 0.5 B 0.5 o 2.5 Put it into a high-speed ball mill and mill it for 10 hours until the average particle size of the powder is 700nm; mix PP resin, CuFe 0.5 B 0.5 o 2.5 , calcium silicate fiber and antioxidant 1010, according to the mass ratio of 100:10:30:0.2, mixed with a high mixer, extruded and pelletized with a twin-screw extruder (Nanjing Rubber and Plastic Machinery Factory), and injection molded into LED Lamp circuit board carrier.
[0061] (2) Use an infrared laser (Tide, DPF-M12) to irradiate the selected area of the LED lamp circuit board carrier, and print out the metal circuit pattern in the selected area. The laser parameters are: wavelength 1064nm, scanning speed 1000mm / s, step The length is 9 μm, the time delay is 30 μs, the frequency is 40 KHz, the power is 3 W, and the filling distance is 50 μm; after the laser irradiation is completed, the surface of the plastic carrier is ultrasonically cleaned.
[0062] (3) Immerse in the chemical nic...
Embodiment 2
[0065] Adopt the method identical with embodiment 1 to prepare the plastic product of the present embodiment, difference is:
[0066] In step (1), the CuB 2 o 4 Ball milled to an average particle size of 800nm and dried; PEEK resin, CuB 2 o 4 , glass fiber and antioxidant 168 are mixed according to the mass ratio of 100:20:30:0.2, extruded and granulated, and then injection molded to form an automobile engine electronic connector housing;
[0067] In step (3), the order of electroless plating is: first electroless nickel plating forms 2 μm thick nickel layer in 8 minutes, then chemical copper plating forms 13 μm thick copper layer in 4 hours, then electroless nickel plating forms 3 μm thick nickel layer in 10 minutes, Finally, a 0.03 μm thick gold layer is flash-plated.
[0068] Through the above steps, the plastic product used as the housing of the electronic connector of the automobile engine in this embodiment is obtained.
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