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Ceramic surface selective metallization method and ceramic

A ceramic surface and selective technology, applied in the field of ceramics, can solve the problems of high metallization cost, low adhesion between the metal layer and the ceramic substrate, and low fineness of the circuit, so as to ensure adhesion, realize selective metallization, and attach Efforts to improve the effect

Active Publication Date: 2014-04-30
HUAWEI TEHCHNOLOGIES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention solves the technical problems of high metallization cost on the ceramic surface, low line fineness and low adhesion between the metal layer and the ceramic substrate existing in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] (1) Preparation of aluminum nitride slurry:

[0042] 55 parts by weight of aluminum nitride powder, 15 parts by weight of glass powder (CaO-Al 2 o 3 -SiO 2 It is glass powder, the content of CaO is 30wt%, Al 2 o 3 The content is 35wt%, SiO 2 content of 35wt%) was added to 29.7 parts by weight of organic solvent (26 parts by weight of terpineol, 2.5 parts by weight of dibutyl phthalate, 1.2 parts by weight of ethyl cellulose), and then added 0.3 parts by weight parts of leveling agent to obtain the aluminum nitride slurry S1 of this embodiment.

[0043] (2) Screen-print the aluminum nitride paste S1 on the alumina ceramic substrate, the amount of paste is 0.005g / cm 2 , and the printing thickness is 30 microns; then baked at 100°C for 10 minutes, transferred to a muffle furnace for sintering at 700°C for 12 minutes, and obtained a ceramic with a prefabricated layer on the surface.

[0044] (3) Place the ceramic in step (2) under a YAG laser with a wavelength of 106...

Embodiment 2

[0047] The ceramic substrate was prepared by the same steps as in Example 1, and the ceramic surface was metallized, and the obtained sample was denoted as S2. The difference was that in step (1), the composition of the aluminum nitride slurry S2 was:

[0048] 50 parts by weight of aluminum nitride powder, 20 parts by weight of glass powder (CaO-Al 2 o 3 -SiO 2 It is glass powder, the content of CaO is 30wt%, Al 2 o 3 The content is 35wt%, SiO 2 The content is 35wt%), 29.7 parts by weight of organic solvent (26 parts by weight of terpineol, 2.5 parts by weight of dibutyl phthalate, 1.2 parts by weight of ethyl cellulose), 0.3 parts by weight of leveling agent.

[0049] Through the above steps, sample S22 was obtained.

Embodiment 3

[0051] The ceramic substrate was prepared by the same steps as in Example 1, and the ceramic surface was metallized, and the obtained sample was denoted as S3. The difference was that in step (1), the composition of the aluminum nitride slurry S3 was:

[0052] 60 parts by weight of aluminum nitride powder, 15 parts by weight of glass powder (CaO-Al 2 o 3 -SiO 2 It is glass powder, the content of CaO is 35wt%, Al 2 o 3 The content is 30wt%, SiO 2 The content is 35wt%), 25 parts by weight of organic solvent (22 parts by weight of terpineol, 2 parts by weight of dibutyl phthalate, 1 part by weight of ethyl cellulose).

[0053] Through the above steps, sample S33 was obtained.

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Abstract

The invention provides a ceramic surface selective metallization method. The method includes A) performing screen printing to a surface of a ceramic substrate by adopting aluminum nitride paste which is a mixture containing organic solvent, glass powder and aluminum nitride; B) drying the product of A step, and sintering, to obtain ceramic having a surface provided with a pre-prepared layer; C) radiating a selected region of the ceramic surface pre-prepared layer of step B by adopting an energy beam, to form a chemical plating active center at the selected region; and D) performing chemical plating to the ceramic surface of step C to form a metal layer at the selected region. The invention also provides a ceramic. The surface of the inventive ceramic is formed with a metal coating, high line precision is achieved, the coating has high adhesion with the ceramic substrate, and low cost is achieved.

Description

technical field [0001] The invention belongs to the field of ceramics, in particular to a ceramic surface selective metallization method and a ceramic. Background technique [0002] Forming a three-dimensional circuit on the ceramic surface can form a three-dimensional circuit carrier integrating electromechanical functions. At the same time, ceramic devices with three-dimensional circuits on the surface have high thermal conductivity and mechanical strength, long service life, strong aging resistance, etc., so they will be widely used in the electronic field. At present, the process of forming a three-dimensional circuit on the ceramic surface is: surface degreasing-mechanical roughening-chemical roughening-sensitization activation-electroless plating, the process is cumbersome, and the obtained metal coating, that is, the adhesion between the circuit and the ceramic substrate is low . [0003] At present, the main methods for forming circuits on ceramic substrates are: (...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B41/90C04B41/85
Inventor 任永鹏林信平张保祥
Owner HUAWEI TEHCHNOLOGIES CO LTD
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