Method for producing plastic product and plastic product
A plastic product and plastic technology, applied in the direction of chemical instruments and methods, layered products, superimposed layers, etc., can solve the complex metallization process of plastic surfaces, high energy requirements, poor adhesion between coatings and plastic substrates, etc. question
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[0014] The invention provides a kind of preparation method of plastic product, comprises the following steps:
[0015] 1) Forming a plastic substrate; the plastic substrate is a thermoplastic or thermosetting plastic containing an electroless plating accelerator, and the electroless plating accelerator is evenly distributed in the thermoplastic or thermosetting plastic; the electroless plating accelerator is Ni 2 o 3 、Co 2 o 3 , CuSiO 3 、CuC 2 o 4 , one or more of Cu / Fe / Mn or Cu / Fe / Al ternary co-sintered oxides, Cu / Fe / Al / Mn quaternary co-sintered oxides;
[0016] 2) Laser vaporizes the surface of the plastic substrate, exposing the electroless plating accelerator;
[0017] 3) Electroless copper or electroless nickel plating is performed on the surface of the electroless plating accelerator in step 2), and at least one electroless plating and / or electroplating is continued to form a metal layer on the surface of the plastic substrate.
[0018] The inventors of the presen...
Embodiment 1
[0047] (1) CuC 2 o 4 2H 2 O, vacuum drying to decrystallize water, ball milling until the D50 is below 1 μm, and drying; PP resin, CuC 2 o 4 , talcum powder and antioxidant 1010 are mixed at a mass ratio of 100:15:10:0.2 and then extruded into pipes with a single-screw extruder (Nanjing Rubber and Plastic Machinery Factory) at a temperature of 180°C .
[0048] (2) Use an infrared laser (Tide, DPF-M12) to irradiate the outer surface of the entire pipe. The laser parameters are: wavelength 1064nm, scanning speed 1000mm / s, step size 9μm, delay 30μs, frequency 40KHz, power 3W, filling spacing 50μm; clean the surface of the pipe.
[0049] (3) Immerse in the electroless copper plating solution for 3 hours to form a copper layer with a thickness of 10 μm, and immerse in the electroless nickel plating solution for 10 minutes to form a nickel layer with a thickness of 3 μm on the outside of the copper layer; electroless copper plating solution: CuSO4 ·5H 2 O 0.12mol / L, Na 2 EDTA...
Embodiment 2
[0052] Adopt the method identical with embodiment 1 to prepare the plastic product of the present embodiment, difference is:
[0053] In step (1), the CuSiO 3 Ball mill until the D50 is less than 2 μm, dry; PC resin, CuSiO 3 , Antioxidant 168, and EVA wax are mixed according to the mass ratio of 100:20:0.2:0.1, extruded and granulated, and then injection molded into electrical casings;
[0054] In step (2), the infrared laser is used to print the metal circuit pattern on the electrical casing; after the laser vaporization is completed, the electrical casing is ultrasonically cleaned;
[0055] In step (3), the sequence of electroless plating is: first electroless nickel plating for 10 minutes to form a 3 μm thick nickel layer, then electroless copper plating for 3 hours to form an 11 μm thick copper layer, and finally electroless nickel plating for 10 minutes to form a 3 μm thick nickel layer.
[0056] Through the above-mentioned steps, the plastic product used as an electric...
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