Preparation method of plastic product and plastic product
A technology for plastic products and plastics, applied in the field of surface metallization of non-metallic materials, can solve the problems of complex metallization process of plastic surface, poor adhesion between coating and plastic substrate, and high energy requirements
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[0019] The invention provides a kind of preparation method of plastic product, comprises the following steps:
[0020] 1) molding plastic matrix; described plastic matrix is the thermoplastic or thermosetting plastic that contains electroless plating accelerator, and electroless plating accelerator is evenly distributed in thermoplastic or thermosetting plastic; Described electroless plating accelerator is Ni 2 o 3 、Co 2 o 3 , CuSiO 3 、CuC 2 o 4 , one or more of Cu / Fe / Mn or Cu / Fe / Al ternary co-sintered oxides, Cu / Fe / Al / Mn quaternary co-sintered oxides;
[0021] 2) Laser vaporizes the surface of the plastic substrate, exposing the electroless plating accelerator;
[0022] 3) Electroless copper plating or electroless nickel plating on the surface of the electroless plating promoter in step 2), continue to perform at least one electroless plating and / or electroplating, and form a metal layer on the surface of the plastic substrate.
[0023]The inventors of the present in...
Embodiment 1
[0052] (1) CuC 2 o 4 2H 2 O, vacuum drying to decrystallize water, ball milling until the D50 is below 1 μm, and drying; PP resin, CuC 2 o 4 , talcum powder and antioxidant 1010 are mixed with a high-speed mixer at a mass ratio of 100:15:10:0.2, and then extruded into pipes with a single-screw extruder (Nanjing Rubber and Plastic Machinery Factory), and the extrusion temperature is 180°C .
[0053] (2) Use an infrared laser (Tide, DPF-M12) to irradiate the outer surface of the entire pipe. The laser parameters are: wavelength 1064nm, scanning speed 1000mm / s, step size 9μm, delay 30μs, frequency 40KHz, power 3W, filling spacing 50μm; clean the surface of the pipe.
[0054] (3) immerse in the electroless copper plating solution for 3 hours to form a copper layer with a thickness of 10 μm, immerse in the electroless nickel plating solution for 10 minutes, and form a nickel layer with a thickness of 3 μm on the outside of the copper layer; electroless copper plating solution:...
Embodiment 2
[0057] Adopt the method identical with embodiment 1 to prepare the plastic product of the present embodiment, difference is:
[0058] In step (1), the CuSiO 3 Ball mill until the D50 is less than 2 μm, dry; PC resin, CuSiO 3 , antioxidant 168, and EVA wax are mixed in a mass ratio of 100:20:0.2:0.1, extruded, granulated, and then injection molded into an electrical housing;
[0059] In step (2), the infrared laser is used to print out the metal circuit pattern on the electrical appliance casing; after the laser gasification is completed, the electrical appliance casing is ultrasonically cleaned;
[0060] In step (3), the order of the electroless plating is: first electroless nickel plating for 10 minutes to form a 3 μm thick nickel layer, then electroless copper plating for 3 hours to form an 11 μm thick copper layer, and finally electroless nickel plating for 10 minutes to form a 3 μm thick nickel layer.
[0061] Through the above-mentioned steps, the plastic product used a...
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