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A kind of preparation method of plastic product and a kind of plastic product

A technology of plastic products and plastics, which is applied in the direction of plating of superimposed layers, metal material coating process, liquid chemical plating, etc. Advanced problems, to achieve the effect of low cost, low energy requirement and simple process

Active Publication Date: 2011-12-14
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The invention aims to solve the technical problems of complex plastic surface metallization process, high energy requirements, and poor adhesion between the coating and the plastic substrate in the prior art

Method used

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preparation example Construction

[0014] The invention provides a kind of preparation method of plastic product, comprises the following steps:

[0015] 1) Forming a plastic substrate; the plastic substrate is a thermoplastic or thermosetting plastic containing an electroless plating accelerator, and the electroless plating accelerator is evenly distributed in the thermoplastic or thermosetting plastic; the electroless plating accelerator is a general formula ABO 3 A perovskite structure compound, wherein A contains at least one of the elements in the 9th, 10th, and 11th columns of the periodic table, and A selectively contains one or more of the IA, IIA group elements, and lanthanide elements; B One or more of the group IVB and VB elements;

[0016] 2) Laser vaporizes the surface of the plastic substrate, exposing the electroless plating accelerator;

[0017] 3) Electroless copper or electroless nickel plating is performed on the surface of the electroless plating accelerator in step 2), and at least one ele...

Embodiment 1

[0049] (1) CaCu 3 Ti 4 o 12 Put it into a high-speed ball mill and mill it for 10 hours until the average particle size of the powder is 700nm; mix PPE / PPS resin alloy, CaCu 3 Ti 4 o 12 , Calcium silicate fiber and antioxidant 1010, according to the mass ratio of 100:10:30:0.2, mixed with a high-speed mixer, extruded and granulated with a twin-screw extruder (Nanjing Rubber and Plastic Machinery Factory), and then injection molded into LED Lamp circuit board carrier.

[0050] (2) Use an infrared laser (Tide, DPF-M12) to print metal circuit patterns on the LED lamp circuit board carrier. The laser parameters are: wavelength 1064nm, scanning speed 1000mm / s, step size 9μm, delay 30μs, frequency 40KHz , power 3W, filling pitch 50 μm; after the laser irradiation is completed, the surface of the plastic carrier is ultrasonically cleaned.

[0051] (3) Immerse in the chemical nickel plating solution for 10 minutes to form a nickel layer with a thickness of 3 μm; immerse in the c...

Embodiment 2

[0054] Adopt the method identical with embodiment 1 to prepare the plastic product of the present embodiment, difference is:

[0055] In step (1), the CuNiTi 2 o 6 Ball milled to an average particle size of 800nm ​​and dried; PEEK resin, CuNiTi 2 o 6 , glass fiber and antioxidant 168 are mixed according to the mass ratio of 100:20:30:0.2, extruded and granulated, and then injection molded into the electronic connector housing of the automobile engine;

[0056] In step (3), the sequence of electroless plating is: first electroless nickel plating for 8 minutes to form a 2 μm thick nickel layer, then electroless copper plating for 3 hours to form a 13 μm thick copper layer, and then electroless nickel plating for 10 minutes to form a 3 μm thick nickel layer, Finally, a gold layer with a thickness of 0.03 μm is flash-plated.

[0057] Through the above steps, the plastic product used as the housing of the electronic connector of the automobile engine in this embodiment is obtai...

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Abstract

The invention provides a plastic product preparation method and a plastic product. The method comprises the following steps of: (1) forming a plastic substrate, wherein the plastic substrate contains a chemical plating accelerating agent, and the chemical plating accelerating agent is a perovskite structure compound having the general formula of ABO3, wherein A contains at least one of elements from No.9, No.10 and No.11 rows in the periodic table of elements and selectively contains one or more elements from IA and IIA families and lanthanide series; and B is one or more elements from IVB and VB families; (2) gasifying the surface of the plastic substrate through laser to expose the chemical plating accelerating agent; and (3) chemically plating copper or chemically plating nickel, continuing chemical plating and / or electroplating at least once to form a metal layer on the surface of the plastic substrate. The preparation method provided by the invention has simple technologies, low requirement for energy and low cost; in addition, the chemical plating accelerating agent is distributed over the plastic substrate, so that the binding force between the coating formed after chemicalplating and the plastic matrix is extremely high.

Description

[0001] related application [0002] This application is a divisional application of the Chinese invention patent application with the application number 201010044447.0, the application date is January 15, 2010, and the invention title is "a preparation method of a plastic product and a plastic product". technical field [0003] The invention belongs to the field of surface metallization of non-metallic materials, and in particular relates to a preparation method of a plastic product and a plastic product. Background technique [0004] A metal layer is formed on the surface of the plastic, which is used as a channel for electromagnetic signal transmission, and is widely used in automobiles, industries, computers, communications and other fields. The selective formation of a metal layer on the plastic surface is a core link in the manufacture of such plastic products. There are many methods for plastic surface metallization production lines. In the prior art, metal nuclei are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C28/00C23C18/38C23C18/32B29C59/16
Inventor 宫清周良苗伟峰张雄
Owner BYD CO LTD
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