Preparation method of combined thermal battery assembly frame
An assembly frame and thermal battery technology, which is applied to battery pack components, circuits, electrical components, etc., can solve problems such as the inability to meet the requirements of high-power combined thermal battery assembly, and achieve the effect of enhancing firmness and ensuring safety.
Active Publication Date: 2015-09-16
CHINA ELECTRONIC TECH GRP CORP NO 18 RES INST
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Problems solved by technology
High-power combined thermal battery requires high structural rigidity, light weight, and fast heat dissipation for its assembly frame, but the currently known combined thermal battery assembly frame cannot meet the assembly requirements of high-power combined thermal battery
Method used
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[0035] Example: Take ten unit thermal batteries with a size of Φ67mm × 215mm assembled into a combined battery as an example, to make a high-power combined thermal battery assembly frame, according to Figure 4-10 As shown, the bottom plate, the tie rod, the top plate, the cover and the fixing clip are made respectively;
[0036] ⑴ production of bottom plate: such as Figure 4-5 As shown, a hard aluminum alloy plate with four concentric rings of bottom plate fixing feet extending outward along the outer circle is selected as the material for making the bottom plate. The outer diameter is Φ390mm and the thickness is 46mm; with the center of the concentric rings as the center, draw five concentric circles on one side of the concentric rings, and divide the largest, smallest and middle three circles into ten equal parts, and each circle is To form ten centers, the lines connecting the ten centers on the largest concentric circle and the ten centers on the smallest concentric cir...
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Abstract
The invention relates to a preparation method of an assembly rack for assembled thermal cells and is characterized in that base plate weight reduction grooves, which are formed by the enclosing of two adjacent base plate skirt borders, large base plate reinforcements and small base plate reinforcements, are processed on a base plate; top board weight reduction grooves, which are formed by the enclosing of two adjacent top board skirt borders, large top board reinforcements and small top board reinforcements, are processed on a top board; manufactured pull bars are disposed between the base plate and the top board; and a diode is fixed inside a cavity of the top board to connect and lead out positive and negative output leads. According to the invention, a plurality of pull bars is arranged into a shape of a circular ring to fasten the base plate and the top board into one body, thus enhancing the firmness of the structure; the skirt borders and reinforcements are arranged on the base plate and the top board and enclosed to form the weight reduction grooves, thus reducing the weight of the assembly rack, raising the rigidity and the heat radiation speed of cells and meeting the requirement of firmly combining many large power elementary cells; the diode is installed on the top board, thus ensuring rapid net retreating after problems appear with the elementary cells and guaranteeing operational security of assembled cells.
Description
technical field [0001] The invention belongs to the technical field of thermal battery combined structure, and in particular relates to a preparation method of a combined thermal battery assembly frame. Background technique [0002] With the in-depth application of thermal batteries in various fields, the requirements for multiple unit cells to form an assembled battery are getting higher and higher. To form an assembled battery with multiple unit cells, multiple unit cells must be fixed through an assembly frame. into one. [0003] Currently known assembled thermal battery assembly racks are generally open tie-rod structures or closed frame structures, most of which are rectangular in shape, with a small number of fixed unit cells and relatively small power constituting an assembled battery. very high. The high-power combined thermal battery requires high structural rigidity, light weight, and fast heat dissipation for its mounting frame, and the currently known combined ...
Claims
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IPC IPC(8): H01M2/10
CPCY02E60/10
Inventor 杨晓勇王帅康培高鹏穆杰
Owner CHINA ELECTRONIC TECH GRP CORP NO 18 RES INST