High-alignment-packaging-type lead frame and packaging structure thereof

Abstract

The invention provides a high-alignment-packaging-type lead frame and a packaging structure thereof, belonging to the technical field of chip packaging. The lead frame is square, is used for packaging a chip with bonding pads which are not equally distributed on four sides, and comprises a pad, inner pins, outer pins, pad connecting ribs and pad reinforcing rings which are fixedly connected between two pad connecting ribs. A lead frame array comprises a plurality of lead frames which are arranged in rows and lines. At the same time, the invention provides the packaging structure which comprises the lead frame. The lead frame can satisfy special packaging requirements on the chips with the bonding pads which are not equally distributed on four sides, the situation of gold wire intersection can be avoided during routing, the asymmetric deformation caused during plastic packaging can be also avoided, the reliability is high and the packaging cost is low.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, in particular to a lead frame, in particular to a lead frame and a lead frame in the form of a high-wire package suitable for packaging a chip (chip die) with unequal numbers of bonding pads distributed on four sides Arrays and their packaging structures. Background technique [0002] Encapsulation is a very important step in the manufacturing process of electronic devices. Through the encapsulation process, various chips (chip die) can be directly drawn out of the circuit, so as to be electrically connected with external circuits. For various chips, the appropriate packaging form is usually selected. [0003] A package structure of a device generally includes a packaged chip, a lead frame and a package (usually a plastic package). Wherein, the lead frame is used to carry the chip and lead out the peripheral interface of the chip to form pins. In the prior art, corresponding to various ...

AI Technical Summary

Problems solved by technology

[0007] figure 1 The LQFP lead frame shown is suitable for packaging a chip with a square shape and equally distributed bonding pads (Bonding Pad) on four sides. There are more bonding pads distributed on the side, and relatively few bonding pads distributed on the wide side, so it is necessary to connect the bonding pads on the edge of the long side of the chip to the inner leads of the lead frame corresponding to the wide side of the chip. On the feet, therefore, there will be crossovers at the corners of the chip, which must be avoided in the packaging process (may be cross-connected and cause the chip circuit function to fail)

In the prior art, in order to avoid the problems caused by lead crossing when packaging rectangular chips, a special arc bending process can be performed during bonding, but this will increase the complexity and risk of the packaging process

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