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Method for improving light quality of chip-on-board (COB) packaging of white light-emitting diode (LED)

A white light and high-quality technology, applied in the field of lighting, can solve the problem of negative deviation of Duv value and achieve the effect of positive Duv value, convenient installation and material saving

Active Publication Date: 2014-06-04
FUJIAN JOINLUCK ELECTRONICS ENTERPRISE
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] 2. When R9 (saturated red) is greater than 0, the Duv value is not within the range and becomes a negative deviation

Method used

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  • Method for improving light quality of chip-on-board (COB) packaging of white light-emitting diode (LED)

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Embodiment Construction

[0019] Please also see figure 1 , is a schematic cross-sectional structure diagram of the white LED COB packaging structure described in the present invention, including mirror aluminum substrate 1, wall glue 2, LED blue light chip 3, nitride red powder layer (Nitride) 4, yellow powder layer 5 (YAG), silica gel and Gold wire 6, mirror-surface reflective layer 11 and several welding pads 12 are also provided on the mirror-surface aluminum substrate 1. The method for improving the light quality of white LED COB packaging according to the present invention is as follows:

[0020] Step 1: Use mirror treatment technology on the reflective concave layer of the aluminum substrate to make a mirror aluminum substrate;

[0021] Step 2: Glue the blue-ray chip on the mirror reflective concave layer of the aluminum substrate with silica gel, fix it by baking, and then wire-bond the gold wire;

[0022] Step 3: Apply a red powder layer on the reflective layer and the LED blue light chip, an...

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Abstract

The invention relates to a method for improving the light quality of chip-on-board (COB) packaging of a white light light-emitting diode (LED). The method comprises the following steps of: sticking a blue light chip to a reflective concave layer of an aluminum-based board by using silica gel, fixing through baking, and binding a gold bonding wire; coating a red powder layer in the reflective concave layer of the aluminum-based board, determining the proportion of blue and red according to the color ratio specification in a spectrum of the white LED, and after requirements are met, baking the red powder layer; coating a yellow powder layer on the upper surface in which the red powder layer, a bonding pad and an insulation layer are contained, and determining the proportion of blue, red and green light according to the color ratio specification in the spectrum of the white LED; and finally, baking for a long time until the silica gel and the aluminum-based board are completely combined. The white LED prepared by the method has the advantages that: a Duv value is more positive, Ra and R9 are relatively high, the color distribution of a visible spectrum is more uniform and is close to that of a standard spectrum, and the white LED has long service life and a high lighting effect, is mainly used for high-watt LED packaged light sources to save materials, is not required to be subjected to reflow soldering, is convenient to install, and is a mainstream light source of further LED lamps.

Description

technical field [0001] The invention relates to the lighting field, in particular to a method for improving the light quality of white LED COB packages. Background technique [0002] As a semiconductor lighting source, white light LED is favored by users all over the world because of its energy saving, environmental protection, small size, long life and many other advantages, and has developed rapidly in recent years. The light quality of traditional white LED COB packaging has the following problems: [0003] 1. When the Duv (color deviation) value is within the range, Ra (color rendering index) is less than 80; when the color rendering index Ra is greater than 80, the Duv value is not within the range; [0004] 2. When R9 (saturated red) is greater than 0, the Duv value is not within the range and becomes a negative deviation. [0005] The above two points are currently used by LED packaging manufacturers to reduce the luminous flux by adding green powder and long-wave r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50
Inventor 薛玉金林庆文张瑜玲
Owner FUJIAN JOINLUCK ELECTRONICS ENTERPRISE