Method for improving light quality of chip-on-board (COB) packaging of white light-emitting diode (LED)
A white light and high-quality technology, applied in the field of lighting, can solve the problem of negative deviation of Duv value and achieve the effect of positive Duv value, convenient installation and material saving
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[0019] Please also see figure 1 , is a schematic cross-sectional structure diagram of the white LED COB packaging structure described in the present invention, including mirror aluminum substrate 1, wall glue 2, LED blue light chip 3, nitride red powder layer (Nitride) 4, yellow powder layer 5 (YAG), silica gel and Gold wire 6, mirror-surface reflective layer 11 and several welding pads 12 are also provided on the mirror-surface aluminum substrate 1. The method for improving the light quality of white LED COB packaging according to the present invention is as follows:
[0020] Step 1: Use mirror treatment technology on the reflective concave layer of the aluminum substrate to make a mirror aluminum substrate;
[0021] Step 2: Glue the blue-ray chip on the mirror reflective concave layer of the aluminum substrate with silica gel, fix it by baking, and then wire-bond the gold wire;
[0022] Step 3: Apply a red powder layer on the reflective layer and the LED blue light chip, an...
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