Light Emitting Diode (LED) and manufacturing process thereof
A technology of light-emitting diodes and manufacturing processes, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of poor light spot effect, inconsistent and bad color of the emitted light, and achieve the effect of uniform light emission
Active Publication Date: 2013-03-20
LEDMAN OPTOELECTRONIC HZ CO LTD
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Problems solved by technology
[0002] At present, the packaging method of light-emitting diodes (hereinafter referred to as LEDs), especially high-power white LEDs for lighting, mainly adopts traditional phosphor coating methods, such as Figure 1 As shown, that is: the phosphor powder is mixed with the potting glue, and then dot-coated on the wafer, but because the thickness and shape of the phosphor coating on the wafer surface cannot be accurately controlled, the color of the emitted light is inconsistent, and there is a bluish or Yellowish light, resulting in poor light spot effect of high-power white LEDs after adding secondary optics, the product does not display well in practical applications, and its luminous effect is shown in the appendix image 3
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[0027] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.
[0028] Please figure 2 , the present embodiment provides a light-emitting diode, including a bracket 4, a primer 1, a wafer 2, a fluorescent glue 5, an outer sealing glue 6 and a wire 3, the wafer 2 is fixed on the bracket 4 through the primer 1, and the wafer 2 is covered with a fluorescent glue 5, the fluorescent glue 5 is covered with an outer sealant 6, and the outer sealant 6 is distributed with granular scatterers 7, and the wire 3 is connected to the support 4 and the chip 2.
[0029] The beneficial effect of this embodiment is: different from the LEDs of the prior art, the light emitted by the chip in the product of the present invention enters the outer sealant 6 through the fluorescent glue, and the light is repeatedly refracted...
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The invention discloses a Light Emitting Diode (LED) and a manufacturing process thereof. The LED comprises a bracket, a primer, a wafer, fluorescent glue, external sealing glue and a lead, wherein the wafer is fixed on the bracket through the primer; the fluorescent glue is coated outside the wafer; the external sealing glue is coated outside the fluorescent glue; granular diffusers are distributed in the external sealing glue; and the lead is used for communicating the bracket with the wafer. Compared with the prior art, the LED has the advantages: when light emitted by a chip of a product enters the external sealing glue through the fluorescent glue, light rays are uniformly diffused through repeatedly refracting or reflecting by the diffusers, so that good luminous spots and uniform irradiance are achieved without lowering the luminous flux of an LED device.
Description
technical field [0001] The invention relates to a light emitting diode and its manufacturing process. Background technique [0002] At present, the packaging method of light-emitting diodes (hereinafter referred to as LEDs), especially high-power white LEDs for lighting, mainly adopts traditional phosphor coating methods, such as Figure 1 As shown, that is: the phosphor powder is mixed with the potting glue, and then dot-coated on the wafer, but because the thickness and shape of the phosphor coating on the wafer surface cannot be accurately controlled, the color of the emitted light is inconsistent, and there is a bluish or Yellowish light, resulting in poor light spot effect of high-power white LEDs after adding secondary optics, the product does not display well in practical applications, and its luminous effect is shown in the appendix image 3 . Contents of the invention [0003] The technical problem mainly solved by the invention is to provide an LED product with ...
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IPC IPC(8): H01L33/48H01L33/58H01L33/00
CPCH01L2224/48091H01L2224/48247H01L2224/8592
Inventor 李漫铁李志新吴丹刘德光
Owner LEDMAN OPTOELECTRONIC HZ CO LTD