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Silicon microphone

A microphone and silicon micro technology, applied in the direction of electrostatic transducer microphones, etc., can solve the problems of reducing the shielding performance of products and the loss of sensitivity of silicon micro microphones, achieving good waterproof and dustproof effect, ensuring electromagnetic shielding effect, and reducing sensitivity loss. Effect

Inactive Publication Date: 2012-03-14
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This design can achieve a better waterproof and dustproof effect, but the design requires that the waterproof membrane 5 be relatively dense, but the dense waterproof membrane design forms a certain sound resistance for the silicon micro-microphone, resulting in the loss of sensitivity of the overall product of the silicon micro-microphone
[0005] At the same time, the above design will also reduce the shielding performance of the product when the silicon micro-microphone adopts a shielding design

Method used

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Embodiment

[0021] figure 1 is a cross-sectional view of a silicon micro-microphone according to an embodiment of the present invention; figure 2 It is a cross-sectional view of the silicon micro-microphone waterproof membrane of the embodiment of the present invention, as figure 1 and figure 2 As shown, the silicon micro microphone includes an upper plate 11 combined from top to bottom, a hollow cavity 12, and an external package structure formed by a circuit board bottom plate 2, and the upper plate 11 is provided with a first sound inlet hole 13. Inside the packaging structure, a silicon acoustic chip 4 and an electrical signal processing chip 3 mounted on the circuit board bottom plate 2 are arranged, wherein the upper plate 11 and the cavity 12 have a shielding design, and are electrically connected to the ground terminal 21 on the circuit board bottom plate 2 and: there are at least two sound inlets 13, and a waterproof membrane 5 attached to the sound inlet 13 is provided ins...

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Abstract

The invention discloses a silicon microphone, which comprises an outer packaging structure, an upper board, a hollow cavity and a bottom circuit board are combined from the top down to form the outer packaging structure, a silicon acoustic chip and an electric signal processing chip are mounted on the bottom circuit board, the upper board is provided with at least two sound inlets, a shielding layer which is electrically connected with the earth terminal of the bottom circuit board is arranged on the upper board and the cavity, and moreover, a water-proof film which is attached on the sound inlets is fixed inside the packaging structure, and is electrically connected with the shielding layer of the upper board and / or the cavity. The design can realize good water-proofing and dust-proofing effects, thus reducing the loss of the sensitivity of the product; and moreover, since the waterproof film is adopted to be connected with the shielding layer of the product, the electromagnetic shielding effect of the product is guaranteed.

Description

technical field [0001] The invention relates to the field of acoustic-electric converters, in particular to a silicon micro-microphone. Background technique [0002] With the development of terminal consumer electronic products, batches of micro-acoustic-electric conversion devices such as MEMS microphones (Micro-Electro-Mechanical-Systems-Microphone) have been gradually applied to the field of consumer electronic products. In the practical application of silicon micro-microphones, while meeting the requirements of low cost and high performance, it is generally required to have dustproof and waterproof functions, which has become a difficult problem in the design of silicon micro-microphones. [0003] The dustproof and waterproof design of the traditional silicon micro-microphone can miniaturize the sound inlet. Although this design can reduce the assembly process in actual production, when the sound hole is set on the metal shell of the silicon micro-microphone, due to pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04
Inventor 庞胜利
Owner GOERTEK INC
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