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Method for measuring fracture toughness of interface between hard film and soft foundation

A fracture toughness and hard film technology, which is applied in the field of measuring the fracture toughness of the hard film and soft substrate interface, can solve the problems of soft substrate deformation and lower test accuracy, and achieve the effect of simple operation

Active Publication Date: 2012-03-28
浙江智柔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional testing methods will lead to large deformation of the soft substrate, and the corresponding nonlinear behavior greatly reduces the accuracy of the test

Method used

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  • Method for measuring fracture toughness of interface between hard film and soft foundation
  • Method for measuring fracture toughness of interface between hard film and soft foundation
  • Method for measuring fracture toughness of interface between hard film and soft foundation

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Embodiment Construction

[0019] The method for measuring the interface fracture toughness of flexible electronic devices provided by the present invention will be further described below in conjunction with the accompanying drawings. The method includes the following steps:

[0020] 1). Place the soft substrate with a hard film on the plate horizontally, fix the A end of the soft substrate, and allow the movement of the B end in the horizontal direction (such as figure 1 Shown in (a), record the original length L of soft base 5;

[0021] 2). Apply horizontal pressure to end B of the soft base, causing the soft base to buckle upwardly ( figure 1 As shown in (b), at this time, the upper surface of the soft substrate is subjected to tensile stress, which makes the interface between the hard film and the soft substrate tend to debond or slip. Continue to apply pressure and observe the interface between the hard film and the soft substrate in real time until debonding or slippage occurs. Record the compr...

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Abstract

The invention discloses a method for measuring the fracture toughness of an interface between a hard film and a soft foundation and belongs to the technical field of engineering materials, structural deformation and mechanical experiment equipment. In the method, due to the bending generated when the soft foundation deflects upward under pressure, the upper surface of the foundation is subjected to the effect of tensile stress, and a debonding or sliding failure happens on the interface between the hard film and the soft foundation; then the method can be used for solving a critical energy release rate of interface failures; and according to the Griffith energy rule, the critical energy release rate of the interface failures is used as the fracture toughness. The method is especially suitable for the structure of hard films and soft foundations, and is easy and convenient to operate.

Description

technical field [0001] The invention relates to a method for measuring the fracture toughness of the interface between a hard film and a soft substrate, and belongs to the technical fields of engineering materials, structural deformation and mechanical experiment equipment. Background technique [0002] Flexible electronics can avoid the hard and brittle characteristics of traditional electronic products. Recently, it has attracted extensive attention from academia and industry. Inorganic flexible electronics (hard film-soft substrate structure) have both excellent electrochemical properties of inorganic semiconductors and excellent plastic substrates. The flexibility performance is the focus of attention. For flexible electronic structures, it is inevitable to withstand repeated stretching, bending and other deformations during use. At this time, debonding and slippage may occur at the interface between the electronic device and the substrate, and the failure of this inter...

Claims

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Application Information

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IPC IPC(8): G01N3/00
Inventor 冯雪黄银曲斌瑞
Owner 浙江智柔科技有限公司
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