Method of manufacturing circuit pattern through sputtering technology and rewiring method of chip
A technology of circuit pattern and sputtering process, applied in circuits, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of many steps and complex processes, and achieve the effect of reducing etching steps, shortening the process flow, and reducing the difficulty of the process
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[0027] Example one
[0028] Please refer to figure 1 , The embodiment of the present invention provides a method for making a circuit pattern through a sputtering process, including:
[0029] 201. A jig is arranged between the component to be sputtered and the cathode of the sputtering equipment, and a through groove of a predetermined shape is opened on the jig.
[0030] The existing sputtering method is generally to perform full-surface sputtering on the components to be sputtered, such as circuit boards or chips, that is: place the components in the sputtering chamber of the sputtering equipment, and start the sputtering equipment. The atoms sputtered by the cathode of the sputtering equipment can act on the entire surface of the component without blocking, and a sputtering layer is formed on the entire surface of the component. Subsequently, etching and other methods are used to remove the sputtered layer at unnecessary parts, and only the sputtered layer at the required parts r...
Example Embodiment
[0038] Embodiment two
[0039] Please refer to Figure 4 , The embodiment of the present invention provides a chip rewiring method, including:
[0040] 301. A photoresist is arranged on the surface of the chip, and the photoresist covers the area on the chip except for the original pads.
[0041] Such as Figure 5a As shown, the entire surface of the chip 440 can be coated with a layer of photoresist 460, and then through exposure and development processes, the photoresist 460 in the original pads 450 of the chip that need RDL is removed, so that these original pads 450 It is exposed, and other parts on the chip 440 are still covered by the photoresist 460.
[0042] 302. Sputter the chip using the method described in the first embodiment to form a required circuit pattern.
[0043] Such as Figure 5b As shown, this step adopts the method of fabricating circuit patterns by sputtering process described in the first embodiment to sputter the chip 440, which is obtained by sputtering direc...
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