Heat tube heat radiator

A technology of heat pipe radiator and heat pipe, which is applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problem of poor heat dissipation effect of radiators, and achieve the effect of optimizing heat dissipation structure

Active Publication Date: 2012-05-02
深圳市研祥智慧科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a heat pipe radiator with compact structure and good heat dissipation effect, especially suitable for heat dissipation of rack servers

Method used

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Embodiment Construction

[0026] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described in detail with reference to the accompanying drawings.

[0027] like Figure 2 to Figure 6 As shown, it is a preferred embodiment of the heat pipe radiator of the present invention, which is a radiator for a 2U rack server. It is easy to cause poor heat dissipation. In the heat pipe radiator of this embodiment, it includes two first heat dissipation units 100a, 100b arranged in parallel, and a second heat dissipation unit 200, wherein the first heat dissipation unit 100a and the CPU 310a on the first motherboard 300a are attached to each other. A heat dissipation unit 100b is attached to the CPU 310b on the second motherboard 300b, and the first heat dissipation units 100a, 100b and the second heat dissipation unit 200 are connected through second heat pipes 400a, 400b respe...

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Abstract

The invention relates to a heat tube heat radiator which is used for heat radiation of a computer system. The heat tube heat radiator comprises a first heat radiating unit, a second heat radiating unit and a second heat tube for connecting the first heat radiating unit and the second heat radiating unit, wherein the first heat radiating unit comprises a heat conducting base part, a first heat tube and a plurality of first heat radiating fins; the first heat radiating fins are arranged on the heat conducting base part; one end of the first heat tube is connected with the heat conducting base part; the other end of the first heat tube is in heat-conducting connection with the first heat radiating fins; the second heat radiating unit comprises a fan and a plurality of second heat radiating fins arranged at the air output side of the fan; the first end of the second heat tube is connected with the heat conducting base part; and the second end of the second heat tube is in heat-conducting connection with the second heat radiating fins. In the heat tube heat radiator disclosed by the invention, part of heat of the heat conducting base part is introduced to the second heat radiating unit arranged at an air outlet of the computer system by the second heat tube and is dissipated outwards by the second heat radiating unit. According to the heat tube heat radiator, a heat radiating structure inside the computer is optimized; and the heat tube heat radiator is especially suitable for the computer systems with narrow case spaces.

Description

technical field [0001] The invention relates to a heat dissipation device for electronic products, more specifically, to a heat pipe radiator. Background technique [0002] In the existing computer system, the power of the central processing unit (CPU) is increasing, and a large amount of heat is generated during its operation. In order to solve the heat dissipation problem of the CPU, heat pipe radiators are widely used. Existing heat pipe radiators are generally composed of a number of heat dissipation fins, heat pipes and bases. The heat dissipation fins are respectively provided with perforations. By using the perforations, the heat dissipation fins are superimposed on one end of the heat pipe at a certain distance. The other end of the heat pipe One end is connected to the base, and the base is attached to the surface of the CPU to absorb the heat generated during the operation of the CPU, and transfer the absorbed heat to the heat sink through the heat pipe to dissipat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 陈志列李绒花
Owner 深圳市研祥智慧科技股份有限公司
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