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Heat dissipation structure of intelligent power module, display module having the same, and method for installing heat dissipation plate for intelligent power module

一种散热结构、智能电源的技术，应用在运输和包装、电气设备构造零部件、电路等方向，能够解决仅有散热器不够等问题

Inactive Publication Date: 2006-07-26
SAMSUNG SDI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, heat sinks alone are not enough to prevent damage to circuit components due to heat or to prevent circuit failure

Method used

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  • Heat dissipation structure of intelligent power module, display module having the same, and method for installing heat dissipation plate for intelligent power module
  • Heat dissipation structure of intelligent power module, display module having the same, and method for installing heat dissipation plate for intelligent power module
  • Heat dissipation structure of intelligent power module, display module having the same, and method for installing heat dissipation plate for intelligent power module

Examples

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Embodiment Construction

[0035] Now turning to the attached image, figure 1 is a perspective view of a display module of a plasma display device. Reference below figure 1 , the display module includes a display panel 50 , a plurality of driving circuit boards 40 electrically connected to the display panel 50 through a plurality of connecting cables 20 , and an outer frame 10 , the outer frame includes an outer frame for supporting the display panel 50 and the driving circuit board 40 Frame bottom plate 11 .

[0036] Typically, the display panel 50 is attached to the front surface of the bezel chassis 11 . In particular, for a plasma display panel, the display panel 50 includes a front panel 51 and a rear panel 52 connected together. The driving circuit board 40 is attached to the rear surface of the outer frame bottom plate 11 . The outer frame bottom plate 11 protects the display panel 50 and the driving circuit board 40 from being deformed due to external impact or protects them from their own w...

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PUM

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Abstract

A heat dissipation structure of an intelligent power module includes a chassis base, a drive circuit board arranged on the chassis base, an intelligent power module arranged at a side of the drive circuit board, the intelligent power module comprising a plurality of circuit devices, a first heat dissipater having one surface contacting a surface of the intelligent power module, the first heat dissipater being adapted to dissipate heat generated by operation of the plurality of circuit devices, and a second heat dissipater having one side arranged in contact with another surface of the first heat dissipater and another side arranged to contact a surface of the chassis base.

Description

[0001] priority claim [0002] The present application is hereby incorporated by reference, and also claims the serial number 10-2005-0003980, entitled "Heat Dissipation Structure of Smart Power Module, with the Display Module with Heat Dissipation Structure and Method for Mounting Heat Dissipation Plate for Intelligent Power Module" patent application under 35 U.S.C. ξ119. technical field [0003] The present invention relates to a heat dissipation structure of an intelligent power supply module, a display module having the heat dissipation structure and a method of installing the heat dissipation structure, in particular to a heat dissipation structure of an intelligent power supply module with improved heat dissipation performance and easy installation, A display module with the heat dissipation structure and a method for installing the heat dissipation structure for an intelligent power module. Background technique [0004] The display module includes a display panel, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G12B15/00G09F9/00H01L23/36H01L23/40
CPCH05K7/20963H01L2924/0002H01L2924/00B62K21/22B62K21/16
Inventor 郑光珍
Owner SAMSUNG SDI CO LTD
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