Efficient surface-mounted triode with good heat dissipation structure

A heat-dissipating structure and high-efficiency technology, applied in electrical components, electric solid-state devices, circuits, etc., can solve the problems of affecting service life, poor structural strength and wear resistance, easy to be damaged by high temperature, etc. Easy to install and fix, avoid damage and cracking

Active Publication Date: 2020-01-24
GUANGDONG HOTTECH IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-efficiency patch triode with a good heat dissipation structure to solve the problem that the existing patch triode proposed in the above background technology has a relatively simple structure, does not have a good heat dissipation structure, and is easily damaged by high temperature inside. Therefore, it needs to be replaced frequently, which increases the cost of use, and the connection between the pin and the package shell is prone to moisture, which leads to erosion and aging, which affects the service life, and the structural strength and wear resistance are poor, and it is easy to be damaged or cracked.

Method used

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  • Efficient surface-mounted triode with good heat dissipation structure
  • Efficient surface-mounted triode with good heat dissipation structure
  • Efficient surface-mounted triode with good heat dissipation structure

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] In the description of the present invention, unless otherwise stated, the meaning of "plurality" is two or more; the terms "upper", "lower", "left", "right", "inner", "outer" , "front end", "rear end", "head", "tail", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather...

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Abstract

The invention discloses an efficient surface-mounted triode with a good heat dissipation structure and belongs to the technical field of surface-mounted triodes. The efficient surface-mounted triode comprises a packaging outer shell, a wear-resistant anti-cracking assembly and a heat dissipation assembly; pins are installed at the lower portion of the packaging outer shell; a sealing waterproof assembly is fixed to the outer sides of the joints of the pins and the packaging outer shell; the wear-resistant anti-cracking assembly is fixed to the outer side of the packaging outer shell; a fixingplate is integrally connected to the upper portion of the packaging outer shell; a threaded hole is formed in the middle of the fixing plate; a main body chip is installed in the middle of the interior of the packaging outer shell; a reinforced protection assembly is installed on the outer side of the main body chip; conductive layers are welded to the joints of the main body chip and the pins; and insulating layers are fixed to the upper side and the lower side of the main body chip respectively. According to the efficient surface-mounted triode of the invention, the sealing waterproof assembly is adopted, the connecting positions of the pins and the packaging outer shell can be conveniently prevented from being affected with damp and aged; and the heat dissipation assembly is adopted, sothat the efficient heat dissipation of the surface-mounted triode is facilitated.

Description

technical field [0001] The invention relates to the technical field of patch triodes, in particular to a high-efficiency patch triode with a good heat dissipation structure. Background technique [0002] SMD triode belongs to an electronic component. The basic function of SMD triode is to amplify. It can amplify weak electrical signals to a certain intensity. An important parameter of the triode is the current amplification factor β. When a small current is applied to the base of the triode, a current that is β times the injected current can be obtained on the collector, that is, the collector current. And a small change in the base current can cause a large change in the collector current, which is the amplification effect of the SMD transistor. [0003] The existing patch triode has a relatively simple structure, does not have a good heat dissipation structure, and is easily damaged by high temperature inside, so it needs to be replaced frequently, which increases the co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L23/367
CPCH01L23/3672H01L23/49568
Inventor 陈国斌
Owner GUANGDONG HOTTECH IND
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